Component-Embedded Substrate Via Surface Roughness
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Solution Overview
Problem
The existing methods for forming through-via electrodes in component-embedded substrates result in increased surface roughness due to large-diameter fillers, leading to degraded high-frequency characteristics as current flow is obstructed, increasing resistance.
Innovation Solution
A manufacturing method that forms a patterning resist without fillers, allowing for smooth through holes and electrodes, followed by electrolytic plating to create through-via electrodes, ensuring a smooth surface and improved filling properties with a resin containing larger-diameter fillers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a resin including large-diameter filler is used to seal an electronic component, then the filling property of the resin is improved, but the surface roughness of the through-via electrode increases
Solution Approach 1:
The through-via electrode is formed by filling the through hole with electrode material before the resin sealing process. This preliminary formation ensures that the electrode surface is established before the resin with large-diameter filler is applied, preventing the filler from affecting the electrode's surface smoothness while still allowing the resin to provide good filling properties for sealing the electronic component.
2Ease of manufacture
If the surface roughness of the through-via electrode is large, then the filling property of resin is improved, but the resistance of the through-via electrode increases
Solution Approach 1:
The through-via electrode is formed in advance before resin sealing, establishing a smooth surface that minimizes resistance for high-frequency current flow. The subsequent resin application with large-diameter filler provides excellent filling and sealing properties without affecting the already-formed electrode surface, thus resolving the contradiction between filling property and electrical performance.
3Productivity
If a through hole is formed by laser in a resin substrate including filler, then the through hole is formed efficiently, but filler protrusions and dents are formed on the inner surface
Solution Approach 1:
The through hole is formed by laser drilling through the resist before the resin sealing process. Although this creates filler protrusions and dents on the inner surface, the subsequent electrode material filling process creates a smooth surface by displacing or encapsulating these irregularities. The electrode is formed in advance before resin sealing, preventing the resin filler from exacerbating the surface roughness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a reduced surface roughness of through-via electrodes, enhancing high-frequency characteristics by minimizing resistance and improving filling efficiency while maintaining uniform linear expansion coefficients.
Implementation Method 1
followed by electrolytic plating to create through-via electrodes
Data Source
AI summary
A method of manufacturing a component-embedded substrate includes a resist forming step in which a patterning resist is formed on a support, a patterning step in which a through hole extending through the resist is formed by performing patterning on the resist, a first-electrode forming step in which a through-via electrode is formed by filling the through hole with an electrode material, a resist removing step in which the resist is removed, a component placement step in which an electronic component is placed, a substrate forming step in which a resin substrate is formed by sealing the electronic component with a resin that includes a filler having a diameter larger than the surface roughness of a side surface of the through-via electrode, and a removing step in which the support is removed from the resin substrate. The first-electrode forming step is performed before the substrate forming step is performed.