Component Embedding in Cured Core on Conductive Foil
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Solution Overview
Problem
Current methods for embedding components in component carriers, such as printed circuit boards, are challenging due to the need for complex manufacturing processes and the use of temporary carriers like sticky tape, which can lead to alignment issues and thermal limitations.
Innovation Solution
A method involving a cured core with a recess on an electrically conductive foil, where the component is mounted directly on the foil, allowing for precise alignment and elimination of sticky tape, with the foil forming part of the component carrier for mechanical and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If components are embedded in a laminate using conventional methods with sticky tape and through holes, then component embedding is achieved, but the manufacturing process becomes complex and alignment precision deteriorates
Solution Approach 1:
The invention extracts and eliminates the sticky tape from the manufacturing process. By mounting the component directly on the foil without sticky tape, the process becomes simpler and alignment precision is improved. The foil itself serves as the mounting substrate, removing the intermediate sticky tape layer that caused alignment issues.
Solution Approach 2:
The foil serves multiple functions: it acts as the mounting substrate for the component, provides electrical connectivity, and serves as part of the final component carrier structure. This multi-functionality eliminates the need for separate sticky tape and reduces manufacturing steps.
2Reliability
If sticky tape is used as a temporary carrier for component mounting, then component embedding is enabled, but thermal limitations and alignment issues occur
Solution Approach 1:
The sticky tape is completely removed from the process. The component is mounted directly on the foil, eliminating the intermediate carrier that caused both thermal limitations and alignment problems. The foil provides both mechanical support and electrical connectivity without the thermal constraints of sticky tape.
Solution Approach 2:
The invention changes the material parameter from sticky tape (temporary carrier with thermal limitations) to foil (permanent structural element with superior thermal and mechanical properties). This parameter change simultaneously improves thermal performance and alignment precision.
3Ease of manufacture
If a cured core with recess is used on foil, then manufacturing is simplified and alignment is improved, but the core structure must be precisely formed
Solution Approach 1:
The recess is formed in the core before the component is mounted. This preliminary action allows for precise positioning and alignment to be established beforehand, and the component is then simply placed into the pre-formed recess, simplifying the overall manufacturing process.
Solution Approach 2:
The invention replaces the complex mechanical assembly of mounting components on sticky tape with a simpler process of placing components into pre-formed recesses on the foil. This substitution of the mounting mechanism reduces manufacturing complexity while maintaining or improving precision.
Data Source
AI summary
A method of embedding a component in a component carrier, wherein the method comprises providing a cured core with a recess on an electrically conductive foil, and mounting the component in the recess on the foil.