Electronic Component Extraction via Thermal-Mechanical Loosening
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Solution Overview
Problem
Modern electronic devices pose a challenge in extracting valuable electronic components, such as CPUs and memory chips, due to their bonding onto circuit boards, making reuse or recycling difficult and costly.
Innovation Solution
A method and system involving heating and physical disturbance, using a heating chamber and hammer arrangement to loosen components from printed circuit boards by applying controlled heat and vibration, allowing for the separation and removal of electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are bonded onto circuit boards with strong adhesive for reliable operation, then the reliability of the electronic device is improved, but the difficulty and cost of extracting components for reuse or recycling increases
Solution Approach 1:
The system applies preliminary heating to the circuit board before component extraction to soften the adhesive bonds. By pre-heating the board to a controlled temperature, the adhesive becomes less viscous and easier to break, allowing components to be removed with minimal force and damage. This preliminary thermal action resolves the contradiction by preparing the bond in advance for easy breaking while maintaining its strength during normal operation.
Solution Approach 2:
The invention changes the physical parameters of the adhesive by controlling temperature and vibration during extraction. By adjusting the heating temperature and vibration frequency, the adhesive transitions from a strong bonding state during operation to a softened state during extraction. This parameter change allows the same adhesive to provide both reliable bonding and easy extractability, resolving the technical contradiction.
2Reliability
If components are extracted by manual removal methods, then the risk of damage to components is reduced, but the time and labor required for extraction increases
Solution Approach 1:
The system employs mechanical vibration through a hammer arrangement that delivers controlled vibrations to the circuit board during component extraction. The vibration frequency and amplitude are optimized to loosen the adhesive bonds and facilitate component removal without causing damage. This mechanical vibration enables rapid extraction while maintaining component integrity, resolving the contradiction between extraction speed and component safety.
Solution Approach 2:
The invention replaces traditional manual mechanical removal with a controlled thermal-mechanical system. Instead of using forceful manual tools that risk component damage, the system uses controlled heating combined with gentle vibration to naturally loosen bonds. This substitution of mechanical force with thermal-mechanical assistance enables both high extraction speed and component integrity.
3Productivity
If high heat is applied to melt adhesive quickly, then the extraction speed is improved, but the risk of damaging electronic components increases
Solution Approach 1:
The heating system applies heat locally and selectively to specific areas of the circuit board where components need extraction. The heating elements are positioned to target only the regions containing adhesive bonds, while sensitive components are either shielded or positioned away from direct heat exposure. This local heating approach enables fast extraction without subjecting entire components to damaging temperatures.
Solution Approach 2:
The system continuously delivers controlled heat to the circuit board throughout the extraction process, maintaining an optimal temperature range that keeps the adhesive soft without overheating components. The continuous heating, combined with continuous vibration, ensures steady progress in component removal while preventing thermal damage. This continuous controlled action resolves the contradiction between extraction speed and thermal safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively separates electronic components from printed circuit boards, enabling their reuse or recycling by melting or softening the adhesive, thus facilitating the extraction process while minimizing damage to the components.
Implementation Method 1
heating an electronic device having one or more electronic components by delivering heat energy to the electronic device directly to a first side surface or a second side surface
Implementation Method 2
separates electronic components from printed circuit boards, enabling their reuse or recycling by melting or softening the adhesive
Implementation Method 3
disturbing the electronic device to separate the one or more electronic components from the electronic device
Implementation Method 4
the hammer arrangement includes an elongated hammer member arranged to rotate to continuously disturb the electronic device
Data Source
AI summary
A method for extracting electronic components comprising the steps of heating an electronic device having one or more electronic components by delivering heat energy to the electronic device directly to a first side surface or a second side surface of the electronic device and disturbing the electronic device to separate the one or more electronic components from the electronic device.