Electronic Component Housing With Outward-Bending Impact Relief
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Solution Overview
Problem
Housings for electronic components face deformation and pressure transfer during transportation due to vibrations or drops, which can damage the components, as they are fixed to the housing with screws, leading to potential deformation and increased pressure on the components.
Innovation Solution
A housing design featuring a band-shaped convex portion on the side plate portions that extends outward, with inclined bent portions to relieve pressure by deforming outward when external pressure is applied, reducing the pressure transferred to the electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the housing is made rigid to protect electronic components, then protection capability is improved, but pressure is transferred to components during impact
Solution Approach 1:
The patent introduces a flexible deformation structure in the form of a convex portion with bent portions that can elastically deform during impact. This flexible structure absorbs impact energy through deformation, preventing rigid pressure transfer to the electronic components while maintaining overall housing strength.
Solution Approach 2:
The convex portion with bent portions is pre-designed to deform during impact, creating a cushioning effect before the impact force reaches the electronic components. This beforehand cushioning structure absorbs the shock energy, reducing the harmful pressure transmitted to the components.
2Object-affected harmful factors
If the housing deforms to absorb impact, then pressure on components is reduced, but structural integrity may be compromised
Solution Approach 1:
The housing is segmented into a rigid main body and a localized flexible convex portion. This segmentation allows the majority of the housing to maintain structural integrity while the specific convex portion deforms to absorb impact, resolving the contradiction between overall strength and local flexibility.
Solution Approach 2:
The convex portion with bent portions is designed with local flexibility at a specific location, while the rest of the housing maintains rigid structural integrity. This local quality approach allows deformation exactly where needed to protect components without compromising the overall strength of the housing structure.
3Reliability
If a convex portion is added to the housing, then impact resistance is improved, but device complexity increases
Solution Approach 1:
The convex portion is integrated directly into the housing structure as a unified component rather than being a separate attachment. This merging of the protective convex structure with the housing itself adds impact resistance while minimizing the increase in device complexity.
Solution Approach 2:
The convex portion serves multiple functions: it acts as both a structural element of the housing and an impact absorption mechanism. This multi-functionality improves impact resistance without requiring additional separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces pressure on electronic components during transportation by allowing the housing to deform outward, minimizing deformation and pressure transfer, thus enhancing impact resistance and protection.
Implementation Method 1
The convex portion includes a band-shaped plateau portion and band-shaped first and second bent portions... The first bent portion includes a first slope portion that is in contact with an edge at or adjacent to the first plate of the plateau portion and extends from the plateau portion toward the first plate portion... The second bent portion includes a second slope portion in contact with an edge of the plateau portion... when pressure is applied due to, for example, vibration or dropping during transportation, pressure applied to the electronic components in the housing can be reduced
Data Source
AI summary
A housing for electronic components includes a first plate portion, a second plate portion, a third plate portion, and a fourth plate portion. At least one of the third plate portion and the fourth plate portion has a band-shaped convex portion including a band-shaped plateau portion, and a band-shaped first bent portion and a band-shaped second bent portion that are located on either side of the plateau portion. The first bent portion includes a first slope portion that is in contact with an edge of the plateau portion at or adjacent to the first plate portion and extends from the plateau portion toward the first plate portion. The second bent portion includes a second slope portion that is in contact with an edge of the plateau portion at or adjacent to the second plate portion and extends from the plateau portion toward the second plate portion while being inclined in a direction opposite to a direction in which the first slope portion is inclined.