Component-Hybrid Core Embedding for Stable Passive Integration
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Solution Overview
Problem
The integration of passive components into the core of a package substrate is challenging due to thickness mismatches, leading to shifting and rotation during embedding, which complicates electrical contact and manufacturing processes.
Innovation Solution
A reconstitution process is employed to fabricate assemblies by coupling passive components to a base substrate, using adhesion layers and molding to create assemblies with a thickness matching the core, followed by singulation, ensuring stable integration and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If passive components are embedded directly in the core, then space utilization is improved, but thickness mismatch causes shifting and rotation during embedding
Solution Approach 1:
The solution divides the embedding process into segments: first creating a recess in the core matching the component thickness, then embedding the component into this pre-prepared cavity. This segmentation allows the component to be placed precisely without shifting or rotating, as the recess provides physical constraints matching the component dimensions.
Solution Approach 2:
The recess is formed in the core before the passive component is embedded. This preliminary action creates a prepared cavity with precise dimensions that match the component, ensuring the component maintains its position during embedding without shifting or rotation, thus solving the manufacturing precision problem while maintaining space utilization.
2Stability of the object's composition
If the core thickness is increased to match passive component thickness, then component stability is improved, but package substrate thickness requirements are violated
Solution Approach 1:
Instead of increasing the core thickness to match the passive component thickness, the solution extracts material from the core to create a recess. This recess has a depth matching the component thickness, allowing the component to be embedded at the correct depth without changing the overall core thickness, thus maintaining both component stability and package substrate thickness requirements.
Solution Approach 2:
The solution addresses the thickness mismatch by working in the vertical dimension through creating a recess, rather than changing the overall core thickness. This dimensional approach allows the component to be embedded at the correct depth while maintaining the original core thickness, resolving the contradiction between component stability and package substrate thickness requirements.
3Device complexity
If passive components are placed on the land side of the package, then routing complexity is reduced, but space utilization decreases
Solution Approach 1:
The solution merges the passive component placement with the core structure by embedding components directly into recesses in the core. This combining of functions allows components to be positioned close to routing layers without adding external complexity, achieving both reduced routing complexity and improved space utilization compared to land-side placement.
Data Source
AI summary
Embodiments disclosed herein include assemblies with component substrates that are coupled to spacer base substrates. In an embodiment, such an apparatus comprises a first substrate with a first width, and a first layer on the first substrate. In an embodiment, a second substrate with a second width is over the first layer, and the second width is smaller than the first width. In an embodiment, a second layer is over the first substrate and around the second substrate.