Component Mounter Clamp Control for Board Thickness Variations
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Solution Overview
Problem
In component mounting, individual differences in board thickness can lead to excessive load on the board presser plate during clamping, causing deformation or breakage, and result in prolonged clamping times when lifting at low speed.
Innovation Solution
A component mounter with a conveyance device, a clamp device comprising a fixed and movable side clamp member, a sensor to measure board thickness, and a control device to adjust the target position of the movable clamp member based on detected thickness, allowing precise positioning and controlled clamping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the clamper is lifted at high speed to a predetermined distance ahead of the target clamping position, then the clamping time is reduced, but an excessive load is generated in the motor or the board presser plate may be deformed when the actual board thickness is larger than expected
Solution Approach 1:
The system performs preliminary measurement of the board thickness using a sensor before clamping. Based on this measured thickness, the control device calculates and sets an appropriate target position for the clamper in advance. This preliminary action prevents the clamper from reaching too far ahead of the actual board surface, thereby avoiding excessive load on the motor and board presser plate while still maintaining efficient clamping time.
Solution Approach 2:
The system incorporates a sensor that measures the actual board thickness and feeds this information back to the control device. The control device uses this feedback to dynamically adjust the target position of the clamper. This feedback mechanism ensures that the clamper stops at the correct position regardless of variations in board thickness, preventing excessive load while maintaining fast clamping operation.
2Reliability
If the clamper is lifted at low speed from beginning, then excessive load is avoided, but a long time is required for the clamping
Solution Approach 1:
The system calculates the appropriate target position in advance based on the measured board thickness. By knowing the exact thickness beforehand, the control device can set a target position that is neither too far ahead (which would cause excessive load) nor too close (which would require slow movement). This allows the clamper to move at optimal speed while avoiding excessive load.
Solution Approach 2:
The system changes the target position parameter based on the measured board thickness. Instead of using a fixed target position, the control device adjusts the target position parameter dynamically according to the actual board dimensions. This parameter change allows the system to optimize both speed and safety for each specific board thickness.
3Device complexity
If a fixed target position is used for the clamper, then the control is simple, but the board may be pressed against the board presser plate before reaching the target position due to individual thickness differences
Solution Approach 1:
The system performs preliminary measurement of board thickness and calculation of the appropriate target position before the clamping operation. This preliminary action provides the control device with the exact information needed to set the correct target position, eliminating the need for complex real-time adjustments while ensuring accurate board pressing for each individual board thickness.
Solution Approach 2:
The sensor measures the actual board thickness and provides feedback to the control device, which then adjusts the target position accordingly. This feedback mechanism maintains control simplicity by using a straightforward measurement-and-adjustment approach, while ensuring that the board is pressed at the correct position regardless of thickness variations.
Data Source
AI summary
A component mounter includes a clamp device that includes a board presser plate, a clamper, and a lifting and lowering device configured to move up and down the damper by driving of a motor, the clamp device being configured to sandwich and clamp the board from both sides by moving the damper with the lifting and lowering device and bringing a board conveyed by a conveyance device into contact with the board presser plate. Then, in a clamp control routine, the component mounter sets a target position of the damper according to a thickness of a board such that a contacting surface of the damper moves to a contacted surface of a fixed side clamp member, and drives and controls the motor by position control such that a clamper position coincides with the target position.