Component Mounting Device Bonding Material Verification

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Solution Overview

Problem

Existing component mounting devices require users to manually investigate the cause of defective component mounting, which is time-consuming and burdensome, especially for users without technical expertise.

Innovation Solution

A component mounting device equipped with a measurement unit and a control unit that automatically verifies the state of the bonding material and infers the cause of defective mounting, reducing the user's burden by providing information on the inferred cause.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of information

If the device displays image data when defective mounting occurs, then the user can verify whether defective mounting has occurred, but the user must manually investigate the cause of defective mounting which places a heavy burden on the user

Engineering Contradiction:
Improveinformation on cause of defective mountingVSAvoiduser burden for investigating cause
Core Design Contradiction:
Loss of informationVSEase of operation

Solution Approach 1:

The control unit automatically verifies the state of the bonding material and infers the cause of defective mounting without requiring manual user investigation. The system serves itself by automatically analyzing measurement data from the measurement unit and communicating the inferred cause, thereby reducing the user's burden to merely receive and act on the communicated information rather than conducting complex investigations

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent replaces the manual mechanical investigation process with an automated control unit that performs verification and inference. The control unit substitutes the user's manual analysis work by automatically processing measurement data and determining the cause of defective mounting, thereby eliminating the need for users to manually examine image data and bonding material states

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of operation

If the control unit automatically verifies the state of the bonding material and infers the cause, then the burden on the user is reduced, but the device complexity increases due to additional measurement and control functions

Engineering Contradiction:
Improveuser burden for investigating causeVSAvoidcomplexity of measurement and control system
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The control unit performs multiple functions including receiving measurement data, verifying the state of the bonding material, inferring the cause of defective mounting, and communicating the results. By consolidating these diverse functions into a single multi-functional control unit, the patent reduces overall system complexity compared to having separate dedicated devices for each function

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines the measurement unit and control unit into an integrated system where the control unit directly processes measurement data without requiring external analysis tools. This merging of measurement and control functions into a unified system simplifies the overall device architecture while maintaining the automated verification and inference capabilities

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11134597B2Component mounting device
Publication Date: 2021.09.28 YAMAHA MOTOR CO LTD
  • US11134597B2 patent drawing
  • US11134597B2 patent drawing
  • US11134597B2 patent drawing

AI summary

A component mounting device includes a mounting portion that mounts a component on a bonding material disposed on a substrate, and a measurement unit that measures a state of the bonding material at least after an operation of mounting the component performed by the mounting portion. The component mounting device further includes a control unit that verifies the state of the bonding material based on a measurement result obtained by the measurement unit when defective mounting of the component has occurred.