Component Mounting Height Measurement via Contact Detection

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Solution Overview

Problem

In component mounting machines, the increase in the number of measurement points for substrate height measurement due to multiple-point height measurement leads to longer measurement times and decreased production efficiency, especially when substrates are warped.

Innovation Solution

A substrate manufacturing method that uses a collecting member to mount components by detecting contact with the substrate using a contact detection sensor and measuring the contact height, allowing for accurate component placement even on warped substrates, and reducing the number of measurement points needed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If multiple-point height measurement processing is used to measure substrate height accurately, then measurement precision is improved, but the number of measurement points increases and measurement time increases, causing productivity to deteriorate

Engineering Contradiction:

Improvesubstrate height measurement precisionVSAvoidproduction efficiency

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The patent performs preliminary height measurement at only one measurement point before component mounting. Based on this single measurement, the system calculates and determines the appropriate mounting height in advance, eliminating the need for multiple measurement points while ensuring accurate component placement on warped substrates

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the measurement parameter from multiple-point height measurement to single-point height measurement. By measuring the height at one point and using calculation to determine the mounting height, the system achieves both measurement accuracy and improved productivity by reducing the number of measurement points required

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If multiple-point height measurement processing is used to account for substrate warpage, then manufacturing precision is improved, but the measurement time increases and productivity decreases

Engineering Contradiction:

Improvecomponent mounting precision on warped substrateVSAvoidproduction efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The system performs preliminary measurement at a single point and calculates the mounting height in advance, taking substrate warpage into account through computational methods rather than physical multiple-point measurements, thereby maintaining manufacturing precision while improving productivity

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces the mechanical multiple-point measurement system with a computational approach. By using calculation based on single-point measurement data, the system determines accurate mounting heights for warped substrates without requiring multiple physical measurement points, thus improving productivity while maintaining precision

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables accurate and efficient component mounting on substrates of varying types and warpage, reducing measurement time and improving production efficiency by minimizing the number of measurement points required.

Implementation Method 1

lowering the collecting member until contact of the component with the substrate is detected by a contact detection sensor, and of measuring a contact height in a mounting position of the component based on the detection of the contact performed by the contact detection sensor

Methodology Applied

Scientific EffectContact detection:

Data Source

PatentUS20250048608A1Substrate manufacturing method and component mounting machine

Publication Date: 2025.02.06 FUJI CORP

AI summary

A substrate manufacturing method is a method for manufacturing a substrate on which multiple components are mounted. In this method, some components among the multiple components are mounted via a first operation of lowering the collecting member until contact of the component with the substrate is detected by a contact detection sensor, and of measuring a contact height in a mounting position of the component based on the detection of the contact performed by the contact detection sensor. In addition, other components are mounted via a second operation of setting a target height based on a measurement result of the contact height when the some components are mounted via the first operation, and of lowering the collecting member until the component is positioned at the target height.