Component Mounting via Dark Region Imaging for Precision Pickup
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Solution Overview
Problem
Miniature components are prone to cracking or chipping during mounting due to uneven load application caused by nozzle size matching the component's diameter and slight displacement in pickup position, especially with varying electrode sizes and reflective surfaces affecting image processing.
Innovation Solution
A component mounting method using image processing to identify the dark color region between electrodes, deriving its position for accurate pickup, and adjusting illumination to enhance contrast, ensuring even load distribution and precise placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If image processing is performed to identify the pickup position, then the pickup position can be determined, but the outline of the image blurs due to light reflection from electrodes and carrier tape, causing displacement in the pickup position
Solution Approach 1:
The patent applies local quality by differentiating the treatment of different regions in the image. Instead of processing the entire image uniformly, the invention specifically targets the dark color portion between electrodes for identification, while excluding the reflective electrode regions from the pickup position calculation. This localized approach to image processing resolves the contradiction by focusing measurement precision on the appropriate region while avoiding the harmful reflection effects from other areas.
2Manufacturing precision
If the nozzle diameter is made the same as the component diameter for precise pickup, then the pickup accuracy improves, but uneven load is applied to the component causing cracking or chipping
Solution Approach 1:
The patent applies preliminary action by identifying and determining the exact pickup position on the component surface before the actual pickup operation. By using image processing to locate the dark color portion and calculate its center as the pickup position, the system prepares the optimal pickup point in advance. This preliminary position determination ensures that when the nozzle picks up the component, the load is evenly distributed through the center, preventing cracking or chipping while maintaining pickup accuracy.
3Adaptability or versatility
If standard carrier tape cavities are used for miniaturized components, then the carrier tape structure remains standardized, but components are unevenly disposed in the cavities due to dimensional tolerance variation
Solution Approach 1:
The patent replaces the mechanical approach of relying on precise cavity dimensions and component placement with an optical/image processing system. Instead of using mechanical fixtures or adjusted cavity sizes to ensure uniform component disposition, the invention uses image processing to identify the actual component position and calculate the pickup position based on the dark color portion. This substitution of mechanical precision with optical measurement and computational analysis resolves the contradiction by maintaining standardized carrier tapes while achieving precise pickup despite component disposition variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Minimizes defects by accurately identifying the pickup position and applying even load, significantly reducing the likelihood of cracking or chipping during component mounting.
Implementation Method 1
the outline of the image indicating the component blurs depending on a magnitude of a reflectance of the electrode provided at both ends of the component
Data Source
AI summary
A component mounting method includes: identifying, by image processing, a dark color region from image data obtained by imaging a two-dimensional region including a pickup face of a component to be picked up; deriving position data indicating a position of the identified dark color region; and deriving, based on the derived position data, a pickup position indicating a position at which a nozzle picks up the component. The imaging is performed by an imaging unit, and the dark color region indicates a dark color portion between electrodes of the component.