Electronic Component Mounting Interference Prevention
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Solution Overview
Problem
In electronic component mounting methods, improper components can interfere with the mounting operation of proper components, leading to potential drops on the printed board, which disrupts the manufacturing process and reduces usability without compromising speed.
Innovation Solution
An electronic component mounting apparatus and method that uses suction nozzles to pick up components, a recognition camera to image and assess their correctness, and a selection device to determine a mounting sequence where improper components are released before or after proper components are mounted, ensuring interference-free operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic components are mounted in sequence without pre-release of improper components, then mounting speed is maintained, but improper components may drop onto the printed board and interfere with the mounting operation
Solution Approach 1:
The system performs recognition of electronic components before the mounting operation, and pre-releases improper components before they can interfere with the mounting process. This preliminary identification and separation of improper components eliminates the risk of interference while maintaining continuous mounting operations for proper components.
Solution Approach 2:
The mounting process is segmented into two distinct sequences: proper components proceed to mounting while improper components are separated and released to a collection box. This segmentation allows simultaneous processing of different component types without mutual interference, maintaining overall productivity while ensuring reliability.
2Reliability
If improper components are released before mounting proper components, then interference with mounting operation is prevented, but additional processing time may reduce manufacturing speed
Solution Approach 1:
The system maintains continuous useful action by processing proper components through mounting without interruption. While improper components are being released and collected, the mounting operation for proper components continues uninterrupted, ensuring that the overall manufacturing speed is not significantly reduced.
Solution Approach 2:
An intermediary collection box serves as a temporary holding area for improper components. This intermediary structure allows improper components to be separated and stored without blocking the mounting path of proper components, enabling parallel processing that minimizes impact on manufacturing speed.
3Device complexity
If all components are processed through recognition and mounting in a single sequence, then device complexity is minimized, but improper components can drop and interfere with the process
Solution Approach 1:
The system extracts improper components from the main mounting sequence by identifying them through recognition and redirecting them to a collection box. This extraction removes the harmful factor of improper components from the mounting process, preventing interference while maintaining a relatively simple overall system structure.
Solution Approach 2:
The system dynamically adjusts the mounting sequence based on recognition results. Proper components follow the standard mounting path while improper components are dynamically redirected to the collection box. This dynamic adaptation allows the system to handle different component types appropriately without requiring completely separate fixed pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents interference during the mounting of proper components by prioritizing the disposal or release of improper components, enhancing usability and maintaining manufacturing speed by ensuring only verified components are mounted on the printed board.
Implementation Method 1
picking up a plurality of electronic components from a component feeding unit by suction using a plurality of suction nozzles
Data Source
AI summary
The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.