Electronic Component Mounting Device for IC Chips at Varying Intervals
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Solution Overview
Problem
Conventional methods for mounting IC chips on electronic devices are inefficient, lack accuracy, and incur high costs due to the need for precise control of chip placement and frequent changes in antenna sheet configurations, leading to increased production complexity and costs.
Innovation Solution
An electronic component mounting device with a removal mechanism, transport mechanism, and mounting and transfer mechanism that allows for simultaneous placement of IC chips at varying intervals on attachments, enabling efficient and accurate mounting while accommodating changes in attachment configurations without requiring extensive retooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If IC chips are individually removed and mounted on attachments one by one, then mounting precision can be maintained, but productivity is low and efficiency is reduced
Solution Approach 1:
The patent combines multiple IC chips onto a single elastic sheet as a group, then mounts the entire sheet onto the attachment simultaneously. This merging of multiple individual mounting operations into a single group mounting operation maintains precision while dramatically improving productivity.
Solution Approach 2:
The elastic sheet serves as an intermediary carrier that holds multiple IC chips in predetermined positions and transfers them collectively to the attachment. This intermediary enables simultaneous mounting of multiple chips without compromising individual positioning accuracy.
2Productivity
If the elastic sheet method is used to mount multiple IC chips, then productivity increases, but mounting accuracy decreases unless positions and stretching properties are controlled with high precision
Solution Approach 1:
The elastic sheet is pre-stretched and pre-positioned on the attachment before the IC chips are mounted. This preliminary preparation ensures that the chips are automatically positioned with high accuracy relative to the attachment features, eliminating the need for post-mounting adjustment.
Solution Approach 2:
The system incorporates detection means to verify the positions of IC chips and the elastic sheet, and adjustment mechanisms to correct any positioning deviations. This feedback loop maintains high mounting accuracy even while using the high-productivity elastic sheet method.
3Ease of manufacture
If a plate with depressions is used to mount electronic components, then mounting can be performed, but the device complexity increases and preparation time increases when changing attachment types
Solution Approach 1:
The elastic sheet mounting system is designed to be universal and can accommodate different attachment types and IC chip configurations through software control and adjustable positioning mechanisms, eliminating the need for dedicated hardware for each attachment type.
Solution Approach 2:
The elastic sheet system uses dynamically adjustable positioning and stretching parameters that can be modified according to different attachment types, replacing the static, fixed configuration of rigid plates with depressions.
4Adaptability or versatility
If the elastic sheet is stretched to adjust intervals between IC chips, then positioning flexibility is achieved, but the cost increases due to the need for high-precision control and frequent retooling
Solution Approach 1:
The system changes parameters such as stretching degree, positioning coordinates, and sheet tension to accommodate different IC chip arrangements and attachment types. This parameter-based adaptability provides positioning flexibility without requiring physical retooling or expensive specialized equipment for each configuration.
Data Source
AI summary
An electronic component mounting device is provided for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion. The electronic component mounting device comprises a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.