Electronic Component Mounting Nozzle Positioning via Pattern Data
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Solution Overview
Problem
Current electronic component mounting processes require a complex trial-and-error method to align the center position of a pattern with the positioning reference point, leading to inaccuracies and inefficiencies in positioning the component at the target location.
Innovation Solution
A component mounting apparatus and method that utilize a camera and control unit to capture and analyze images of the electronic component's patterns, calculate the positional relationship between registration pattern representative points and positioning reference points based on pattern design information, and adjust the mounting nozzle to accurately position the component without trial mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the center position of the pattern to be detected is used for mounting, then the mounting process is simple, but the positioning accuracy deteriorates because the center position does not coincide with the positioning reference point
Solution Approach 1:
The patent applies preliminary action by pre-calculating and storing the positional relationship between the center position of the pattern and the positioning reference point in the control unit before the actual mounting process. This allows the system to automatically compensate for the positional offset without requiring trial mounting, thus maintaining both operational simplicity and positioning accuracy.
2Manufacturing precision
If trial mounting is performed to obtain the amount of shift between center position and positioning reference point, then positioning accuracy is improved, but the process complexity and time consumption increase
Solution Approach 1:
The patent eliminates the need for trial mounting by pre-calculating the positional relationship between the pattern center and positioning reference point and storing it in the control unit. This preliminary preparation allows the system to directly compute the correct mounting position without iterative trial-and-error processes, significantly reducing process complexity while maintaining accuracy.
Solution Approach 2:
The patent replaces the mechanical trial mounting process with an information-based solution. Instead of physically mounting the component multiple times to measure positional shifts, the system uses image recognition to detect the pattern center and then applies pre-stored positional relationship data to calculate the correct mounting position, substituting mechanical measurement with computational methods.
3Manufacturing precision
If trial mounting and measurement are performed to obtain positional shift information, then positioning accuracy is improved, but the time required for mounting increases
Solution Approach 1:
The patent applies preliminary action by pre-calculating and storing the positional relationship data in the control unit before mounting. This eliminates the time-consuming trial mounting and measurement process, allowing the system to directly compute the correct mounting position using image recognition and pre-stored information, thus significantly reducing mounting time while maintaining positioning accuracy.
Data Source
AI summary
A mounting nozzle is capable of holding an electronic component having multiple patterns provided on its pattern surface based on pattern design information. A camera is capable of capturing an image of the pattern surface of the electronic component. A movement mechanism is capable of moving the mounting nozzle between a location where capturing of the image by the camera is performed and a component mounting location. A control unit is capable of controlling the mounting nozzle and the movement mechanism. The control unit stores positional relationship information indicating positional relationship based on the pattern design information between a position of a registration pattern representative point identified by at least one registration pattern selected from the multiple patterns provided on the pattern surface and a position of a positioning reference point on which positioning of the electronic component at the component mounting location for mounting is based.