Component Mounting Offset Correction via Dual-Height Imaging
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Solution Overview
Problem
In surface mounting technology, accurately mounting components on printed circuit boards is challenging due to deviations in the posture of mounting heads, which can result in incorrect positioning, especially with the trend towards miniaturization requiring higher precision.
Innovation Solution
An apparatus and method that utilize two correction cameras to capture images of a component at different heights, calculating a mounting offset by comparing these images to accurately position the component on a substrate, incorporating nozzle and camera offsets to ensure precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the head posture is not corrected, then the mounting process is simple and fast, but the component cannot be mounted at the correct position
Solution Approach 1:
The system performs preliminary actions by capturing images of the component at two different heights before mounting, calculating the mounting offset based on these images, and correcting the head posture in advance. This ensures the component will be mounted at the correct position without requiring complex real-time adjustments during the mounting process.
Solution Approach 2:
The patent replaces complex mechanical posture correction mechanisms with an optical measurement system (two correction cameras) and computational offset calculation. Instead of using complex mechanical devices to physically adjust and maintain head posture, the system uses image capture at different heights, calculates the offset, and applies correction through coordinate transformation, thereby reducing mechanical complexity while improving mounting precision.
2Measurement precision
If single-height image capture is used, then the system is simple, but the mounting offset cannot be accurately calculated
Solution Approach 1:
The patent introduces a new dimension by capturing images at two different heights (Z-axis positions) instead of a single height. This vertical dimension addition enables the calculation of mounting offset by comparing the component's position and orientation in 3D space, providing accurate measurement data that cannot be obtained from a single 2D image.
Solution Approach 2:
The two correction cameras act as intermediaries to indirectly measure the component's mounting offset. Instead of directly measuring the offset during mounting, the system uses intermediate image capture at different heights, processes these images to calculate the offset, and then applies the correction. This intermediary measurement approach enables precise offset calculation without interfering with the actual mounting process.
Data Source
AI summary
An apparatus for mounting a component includes: a head including a nozzle and a substrate recognition camera; a first correction camera generating a first image by capturing an image of a component adsorbed to the nozzle and disposed at a first height; a second correction camera generating a second image by capturing an image of the component adsorbed to the nozzle and disposed at a second height; and a controller obtaining a mounting offset of the component by comparing the first image and the second image with each other and controlling the head so that the component is mounted on the substrate in a state in which the mounting offset is applied.