Electronic Component Mounting Position Correction
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Solution Overview
Problem
Existing electronic component mounting systems face challenges in achieving uniform joint quality due to varying self-alignment effects based on component shape, size, and solder characteristics, leading to potential joint defects when using a single position correction method for all components.
Innovation Solution
An electronic component mounting system that includes a solder position detection and positional-shift calculation mechanism, allowing for two mounting modes: one correcting based on calculated positional-shift amounts and another referencing only the electrode position, tailored for each electronic component's specific characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If uniform mounting position correction based on solder printing position is applied to all electronic components, then the self-alignment effect is utilized to mitigate printing position shift, but large-sized components with large mass do not experience sufficient suction force from surface tension to move, resulting in insufficient alignment effect
Solution Approach 1:
The patent applies different mounting position correction methods to different electronic components based on their specific characteristics. For small-sized components, the self-alignment effect with solder printing position reference is applied, while for large-sized components, direct electrode position reference is used. This local differentiation resolves the contradiction by tailoring the correction approach to each component type's mass and size characteristics.
Solution Approach 2:
The patent dynamically selects the mounting correction method based on component characteristics stored in the storage unit. The system adapts its correction strategy in real-time during the mounting process, switching between self-alignment mode and direct positioning mode according to each component's mass and size, thereby achieving both precision and adaptability.
2Manufacturing precision
If uniform mounting position correction based on solder printing position is applied to all electronic components, then the self-alignment effect is utilized, but when electronic components have asymmetrical planar shape or disposition, asymmetrical suction force acts during solder melting, causing rotation and preventing expected alignment
Solution Approach 1:
The patent differentiates the mounting correction approach based on component shape characteristics. For symmetrical components, self-alignment with solder printing position reference is effective, while for asymmetrical components, direct electrode position reference is applied to avoid rotational issues. This local quality differentiation ensures precision across diverse component geometries.
3Reliability
If mounting position correction considering solder printing position is uniformly employed, then joint quality improvement is expected, but joint defects may be caused for some types of electronic components on the same substrate
Solution Approach 1:
The patent ensures high joint quality for all component types by applying locally optimized correction methods. For components where self-alignment is effective, it improves joint quality through precise positioning, while for components where it causes defects, direct electrode position reference is used to prevent joint defects. This resolves the contradiction between achieving joint quality improvement and maintaining compatibility across different component types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise mounting position correction, enhancing joint quality by adapting to the unique characteristics of each electronic component, thereby reducing defects and improving the overall mounting process.
Implementation Method 1
a printing inspection device that images a substrate after printing by using an imaging camera
Implementation Method 2
the mounting head picks up the electronic component in a pickup process
Implementation Method 3
a so-called self-alignment effect in which the electronic component gravitates with respect to the electrode due to surface tension of molten solder in a reflow process after mounting the component
Data Source
AI summary
An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.