Electronic Component Mounting Apparatus Seam Position Correction

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Solution Overview

Problem

In high-speed electronic component mounting devices, the connection of storage tapes using a connection tape leads to positional shifts at the seam, causing errors in component pickup and reducing the pickup rate due to misalignment between the component storage position and the suction nozzle's pickup point.

Innovation Solution

An electronic component mounting apparatus equipped with a seam detection device, a recognition camera, and a control device that adjusts the component pickup position based on image recognition processing, ensuring accurate component retrieval even at connection seams between storage tapes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If storage tapes are connected using a connection tape to supply components continuously, then the component supply continuity is improved, but the positional accuracy at the connection portion deteriorates causing pickup errors

Engineering Contradiction:
Improvecomponent supply continuityVSAvoidcomponent pickup position accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The system performs preliminary detection of the seam position using a seam detection device before the suction nozzle reaches the connection portion. The recognition camera captures images of the storage portion and component positions in advance, allowing the control device to calculate positional shifts and adjust the pickup position before the actual pickup operation occurs, preventing pickup errors at the connection tape location

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system uses a feedback mechanism where the recognition camera continuously monitors the positions of storage portions and electronic components, the control device calculates the actual positions based on these images, compares them with the standard pickup positions, and adjusts the pickup position in real-time based on the detected positional shifts caused by the connection tape, ensuring accurate component pickup despite the presence of connection tapes

Inventive Principle:
Principle #23Feedback

2Productivity

If the suction nozzle operates at a fixed pickup position, then the pickup operation is simple and fast, but it cannot adapt to positional shifts caused by connection tapes

Engineering Contradiction:
Improvepickup operation speedVSAvoidadaptation to positional shifts
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The system transitions from a static fixed pickup position to a dynamic adjustable pickup position. The control device dynamically adjusts the pickup position based on real-time detection of seam positions and component locations using the recognition camera and seam detection device, allowing the pickup position to adapt to positional shifts caused by connection tapes while maintaining high-speed operation through automated control

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS8336195B2Electronic component mounting apparatus
Publication Date: 2012.12.25 YAMAHA MOTOR CO LTD
  • US8336195B2 patent drawing
  • US8336195B2 patent drawing
  • US8336195B2 patent drawing

AI summary

The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.