Electronic Component Mounting via Solder Paste Position Feedback
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Solution Overview
Problem
Existing electronic components mounting systems face challenges in accurately managing mounting precision due to ineffective utilization of inspection data across processes, leading to position errors in component placement and soldering.
Innovation Solution
An electronic components mounting system that includes a printing apparatus, a print inspection apparatus, an electronic components placement apparatus, and a placement state inspecting apparatus, where soldering position data is used to update control and inspection parameters, enabling precise management of component placement accuracy through continuous feedback and feedforward processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If inspection apparatuses are disposed between each process to perform quality control, then measurement precision is improved, but the inspection information obtained is not effectively utilized leading to loss of information
Solution Approach 1:
The patent implements feedback mechanisms where inspection results from the print inspection apparatus and placement inspection apparatus are fed back to update control parameters in subsequent processes. The print position error detected by the print inspection apparatus is used to correct components placement position, and the placement position error detected by the placement inspection apparatus is used to correct soldering position, ensuring continuous improvement and effective utilization of inspection data throughout the manufacturing process
Solution Approach 2:
The control apparatus serves as an intermediary that collects inspection information from various inspection apparatuses, processes this data, and transmits corrected control parameters to the respective process apparatuses. This intermediary function ensures that inspection information is effectively utilized by bridging the gap between measurement and correction actions
2Productivity
If components placement position is corrected based on solder print position error, then productivity is improved by minimizing rework, but manufacturing precision deteriorates because components are placed shifted from electrode position
Solution Approach 1:
The patent performs preliminary inspection and correction actions at each stage: the print inspection apparatus detects print position error before component placement, and the placement inspection apparatus detects placement position error before soldering. By performing these inspection and correction actions preliminarily at each stage, the system maintains manufacturing precision while ensuring smooth workflow and productivity
Solution Approach 2:
The system uses feedback from placement inspection results to correct soldering control parameters, ensuring that even if components are placed with position errors, the soldering process is adjusted to achieve correct final positioning. This feedback mechanism maintains manufacturing precision while preserving productivity by avoiding rework
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves precise management of mounting accuracy by effectively using inspection information from each process, minimizing position errors and ensuring correct placement and soldering of electronic components on circuit boards.
Implementation Method 1
soldering means for soldering the placed electronic components on the circuit board by heating and melting the solder paste
Implementation Method 2
soldering means for soldering the placed electronic components on the circuit board by heating and melting the solder paste
Data Source
AI summary
In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.