Component Mounting with Temporary Loading for Pickup Deviation Correction
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Solution Overview
Problem
Conventional component mounting devices face accuracy issues due to positional deviations during the component pickup process, leading to compromised mounting accuracy on the board.
Innovation Solution
The component mounting device employs a system with a head, relative moving device, upper and lower imaging devices, and a temporary loading stand to correct pickup deviations by imaging both surfaces of the component, allowing for precise temporary loading and re-picking up, and subsequently accurate mounting on the board, accounting for both pickup and re-pickup deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a component is picked up and mounted directly without temporary loading, then the process is faster, but mounting accuracy deteriorates due to pickup deviation
Solution Approach 1:
The mounting process is divided into two independent stages: first picking up the component and temporarily loading it onto a stand, then picking it up again and mounting it on the board. This segmentation allows the first pickup to be optimized for speed while the second pickup focuses on precision, resolving the contradiction between productivity and manufacturing precision
Solution Approach 2:
A temporary loading stand is introduced as an intermediary device between the pickup and final mounting positions. This stand serves as a reference point that enables accurate positioning during the second pickup operation, allowing the system to maintain high speed in the first pickup while achieving high precision in the final mounting
2Device complexity
If only the upper surface of the component is imaged, then the imaging process is simpler, but pickup deviation cannot be accurately recognized
Solution Approach 1:
The imaging functions for the upper surface and lower surface of the component are merged into a single integrated imaging system. This allows both surfaces to be imaged using coordinated camera movements, achieving accurate pickup deviation recognition without proportionally increasing system complexity
Solution Approach 2:
The imaging system is designed to be dynamic, with cameras that can move and reposition themselves to capture images of different surfaces. This dynamic capability allows the system to image both the upper and lower surfaces as needed, providing accurate deviation measurement without requiring multiple fixed imaging systems
Data Source
AI summary
A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board. The component mounting device picks up the component, images a lower surface of the picked-up component, temporarily loads the picked-up component on a target temporary loading position to a temporary loading stand which is corrected based on a pickup deviation amount of the component to be recognized based on a lower surface image of the imaged component. Subsequently, the component mounting device images an upper surface of the temporarily loaded component, picks up again the component which is temporarily loaded on the temporary loading stand, and images a lower surface of the re-picked up component. Then, the component mounting device mounts the re-picked up component on a target mounting position of the board corrected based on a positional deviation amount of the feature portion.