Electronic component package
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Solution Overview
Problem
Existing electronic component packages face reliability issues during mounting due to direct exposure of external electrodes, which can lead to constricted shapes and breakage of solder bumps.
Innovation Solution
The electronic component package design includes a resin portion covering external electrodes while exposing only extraction electrodes, ensuring that external electrodes are not directly exposed, thereby preventing constricted shapes and enhancing reliability during mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If external electrodes are directly exposed from the resin layer, then ease of connection is improved, but reliability deteriorates due to constricted shapes forming in the external electrodes during mounting
Solution Approach 1:
The patent introduces an intermediary structure (extraction electrode with wider upper portion) between the external electrode and the mounting surface. This intermediary prevents direct contact between the mounting equipment and the vulnerable external electrode, eliminating the constriction problem while maintaining electrical connection functionality.
Solution Approach 2:
The extraction electrode is divided into distinct functional portions: a lower portion for electrical connection to the external electrode and an upper portion with wider width for mounting operations. This segmentation allows each portion to optimize its specific function without compromising the other.
2Reliability
If external electrodes are covered with resin portion, then reliability is improved by preventing constricted shapes, but ease of connection deteriorates as external electrodes become inaccessible
Solution Approach 1:
The extraction electrode serves as a mediator that extends the electrical connection path from the covered external electrode to the external environment. This allows the external electrode to remain protected by the resin while maintaining accessible connection points through the extraction electrode structure.
Solution Approach 2:
The extraction electrode extends vertically from the resin surface, creating a new dimensional access path. Instead of accessing the external electrode horizontally through the resin surface, connection is established vertically through the exposed upper portion of the extraction electrode.
3Reliability
If solder bumps are exposed from resin layer, then electrical connection is achieved, but breakage occurs during mounting due to constricted shapes
Solution Approach 1:
The wider upper portion of the extraction electrode acts as a cushioning structure that absorbs mechanical stress during mounting operations. This prevents the stress from being transmitted to the vulnerable solder bump, thereby preventing breakage before it can occur.
Solution Approach 2:
The extraction electrode structure mediates between the mounting process and the solder bump, providing a protective interface that eliminates direct mechanical interaction between mounting equipment and the fragile solder joint.
Data Source
AI summary
An electronic component package includes: a resin portion having a first surface; one or more electronic components each having a plurality of external electrodes; and a plurality of extraction electrodes electrically connected to the plurality of external electrodes. Only each of the plurality of extraction electrodes is exposed from the resin portion on the first surface. The plurality of external electrodes are covered with the resin portion.