Electronic Component Package With Protruded Electrode Supports
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing electronic component packages face challenges in ensuring a sufficient gap between the electronic element and the substrate to prevent electric short defects and reliability deterioration, especially in high temperature and humid environments.
Innovation Solution
The electronic component package incorporates a substrate with protruded structures on a protection layer, allowing for a sufficient gap between the electronic component and the substrate to be filled with molding material, thereby preventing electric shorts and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the substrate thickness is reduced by embedding wire patterns (ETS technology), then the package thickness is reduced, but the gap between the electronic component and substrate becomes insufficient for molding material filling
Solution Approach 1:
The patent introduces protruded structures that extend vertically from the substrate surface, creating a three-dimensional gap space between the electronic component and substrate. This vertical dimensionality change allows sufficient molding material filling even when the overall package thickness is reduced through ETS technology.
Solution Approach 2:
The protruded structures act as intermediary elements between the substrate and the electronic component, creating a physical space that facilitates proper molding material insertion and filling while maintaining reduced package thickness.
2Length of stationary object
If the gap between electronic component and substrate is insufficient, then package thickness is reduced, but electric short defects occur due to unmolded spaces
Solution Approach 1:
By creating vertical protrusions from the substrate, the patent establishes a controlled three-dimensional gap space that ensures complete molding material filling, thereby preventing electric short defects while maintaining thin package profile.
Solution Approach 2:
The protruded structures are pre-formed on the substrate before component mounting, preliminarily establishing the necessary gap space that will be filled with molding material, thus preventing electric short defects before they can occur.
3Length of stationary object
If the gap between electronic component and substrate is insufficient, then package thickness is reduced, but reliability deteriorates in high temperature and humid environments
Solution Approach 1:
The vertical protruded structures create sufficient three-dimensional spacing that allows complete molding material filling, forming a protective seal that shields the electronic component from high temperature and humid environmental conditions while maintaining reduced package thickness.
Solution Approach 2:
The protruded structures are formed in advance to pre-establish the protective gap space, which is then filled with molding material to create environmental protection before the component is exposed to harsh conditions.
Data Source
AI summary
Provided is an electronic component package including a substrate including an insulating layer, a wiring layer including a first connection pad and a second connection pad, a protection layer disposed on the insulating layer and having an opening exposing at least a portion of each of the first connection pad and the second connection pad, and at least one protruded structure disposed on the protection layer; an electronic component disposed on the substrate and including a first electrode electrically connected to the first connection pad and a second electrode electrically connected to the second connection pad; and a molding material disposed on the substrate to mold the electronic component; wherein the protruded structures include a first protruded structure supporting the first electrode and a second protruded structure supporting the second electrode.