Electronic Component Package Trenches for CTE Mismatch
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Solution Overview
Problem
The existing electronic component packages face reliability issues due to significant differences in coefficients of thermal expansion (CTEs) between the electronic components and the main board, leading to potential cracks and warpage when exposed to harsh environments, particularly affecting the connection terminals like solder balls.
Innovation Solution
The electronic component package incorporates trenches on the upper side of the component to reduce its overall volume, increasing the effective CTE and enhancing contact areas with the encapsulant, thereby improving board-level reliability and adhesion, while also forming redistribution layers and a metal layer for heat radiation and electromagnetic wave blocking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic component package is mounted on the main board, then electrical connection is achieved, but cracks may be generated in connection terminals due to CTE difference between the electronic component and the main board
Solution Approach 1:
The patent changes the physical parameters of the electronic component by forming trenches in the substrate, which reduces the overall volume and modifies the CTE characteristics of the component, thereby reducing the CTE mismatch with the main board and preventing cracks in connection terminals
Solution Approach 2:
The substrate is segmented by forming trenches that divide it into multiple regions, which reduces the overall volume of the electronic component and adjusts its thermal expansion characteristics to better match the main board
2Reliability
If trenches are formed in the electronic component to reduce volume, then CTE mismatch is reduced and reliability is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The trenches are formed in the substrate before the packaging process, allowing the CTE adjustment to be built into the component structure in advance, which simplifies subsequent manufacturing steps while achieving the reliability improvement
3Reliability
If the electronic component volume is reduced by forming trenches, then CTE mismatch with the main board is reduced, but the contact area with encapsulant needs to be increased to maintain adhesion
Solution Approach 1:
The patent applies local quality by increasing the contact area between the substrate and encapsulant in specific regions where trenches are formed, thereby compensating for the reduced overall volume and maintaining strong adhesion while achieving CTE mismatch reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the CTE mismatch between the component and the main board, enhancing the reliability of the electronic component package by minimizing stress on connection terminals and improving heat radiation and electromagnetic wave blocking capabilities.
Implementation Method 1
since a difference between coefficients of thermal expansion (CTEs) of the electronic component and the main board is generally significantly high
Implementation Method 2
forming redistribution layers and a metal layer for heat radiation and electromagnetic wave blocking
Implementation Method 3
forming redistribution layers and a metal layer for heat radiation and electromagnetic wave blocking
Data Source
AI summary
An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.