Component Parameter Sequencing for Tighter Multi-Die Matching
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Solution Overview
Problem
The existing die binning process for multi-die devices, such as power modules, is inefficient due to logistical challenges, overhead costs, and undesirable bins with varying electrical performance specifications, leading to mismatch issues and reduced performance.
Innovation Solution
A method and system that measure component parameters using a testing device and arrange them in a sequential order based on these parameters for shipping and device implementation, ensuring tighter electrical performance distributions and reducing mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional die binning is used to categorize finished dies, then electrical performance similarity within groups is improved, but device complexity increases due to multiple part numbers and logistical overhead
Solution Approach 1:
The patent extracts the essential function of binning (grouping dies by electrical characteristics) while removing the complex part numbering and logistical overhead. Instead of creating multiple part numbers for different bins, the system uses a single part number with the processor dynamically assigning dies to appropriate functional groups based on measured characteristics, thus achieving performance similarity without logistical complexity
Solution Approach 2:
The system changes the approach from static binning (fixed part numbers for fixed electrical ranges) to dynamic parameter-based assignment. The processor measures electrical characteristics and dynamically assigns dies to functional groups based on measured parameters, allowing flexibility without requiring multiple part numbers or complex logistical management
2Manufacturing precision
If traditional binning creates multiple part numbers for different electrical performance ranges, then electrical performance control is improved, but productivity decreases due to increased logistical oversight requirements
Solution Approach 1:
The system implements self-service by allowing the processor to automatically measure, evaluate, and assign dies to functional groups without external logistical intervention. The processor itself performs the binning function internally, eliminating the need for complex external logistical oversight and part number management, thus improving productivity while maintaining electrical performance control
3Reliability
If sequential arrangement of components is implemented, then component mismatch is reduced, but manufacturing complexity increases due to additional sorting requirements
Solution Approach 1:
The patent merges the measurement, evaluation, and sorting functions into a single integrated process performed by the processor. Instead of separate sorting operations, the processor measures electrical characteristics and directly arranges dies in sequential order during the same operational cycle, achieving component matching without adding significant manufacturing complexity
Solution Approach 2:
The system performs preliminary measurement and evaluation of electrical characteristics before final assembly, allowing sequential arrangement to be implemented efficiently. By measuring and sorting dies in advance based on their characteristics, the system reduces mismatch while the integrated processor manages the complexity of the sorting process
Data Source
AI summary
A process includes measuring at least one component parameter of a plurality of components with a testing device; and arranging at least a portion of the plurality of components in a sequential order based on the at least one component parameter with an implementation system in at least one of the following: a shipping format and a device implementation of the portion of the plurality of components. A system is disclosed as well.