Component Placement Using Average Connection Point Positions
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Solution Overview
Problem
The existing method for placing components with connection points on a substrate is time-consuming due to the lengthy process of analyzing images from a camera to determine the positions of the connection points, limiting the number of components that can be placed within a specific period.
Innovation Solution
Determine the contour of a component quickly and calculate average positions of connection points for a batch of similar components, allowing subsequent components to be placed based on these averages, reducing the need for repeated position determination and using a nozzle with a sensor to streamline the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If image analysis is performed to determine connection point positions, then placement precision is improved, but placement speed deteriorates
Solution Approach 1:
The patent performs image analysis and determines connection point positions for a first batch of components in advance, storing these determined positions in memory. When placing subsequent components from the same production batch, the stored positions are reused without repeating the time-consuming image analysis process, thus improving placement speed while maintaining precision
Solution Approach 2:
The patent creates a copy of the determined connection point positions from the first batch of components and applies this copied data to subsequent components. Since components from the same production batch have identical connection point patterns, the position data can be copied and reused, eliminating repeated image analysis and significantly increasing placement rate
2Manufacturing precision
If complete image analysis is performed for each component, then placement accuracy is improved, but time consumption increases
Solution Approach 1:
The system performs the complete image analysis and position determination in advance for reference components, storing the results before production begins. This preliminary action ensures high placement accuracy for all components while the actual placement process only requires retrieving stored data, not performing new analysis
Solution Approach 2:
The patent performs complete image analysis only for a limited number of reference components (partial action) rather than for every single component. This partial analysis approach provides sufficient precision for the entire batch while dramatically reducing total time consumption, as the analysis is performed once rather than repeatedly for each component
Data Source
AI summary
A method for placing at least one component provided with connection points on a substrate. First, positions of the connection points are determined, after which the component is positioned at desired positions on the substrate with the connection points thereof. Upon placement of a number of components, the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components. On the basis of the calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated. Upon placement of a second number of components the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions.