Electronic Component Plating Impregnation for Stronger Electrode Bonding
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Solution Overview
Problem
The bonding strength between the external electrode and the plating layer, as well as between the external electrode and the internal conductor, is weakened due to the formation of cavities caused by the burning out of resin in the internal conductor during the firing process, leading to potential conduction failures.
Innovation Solution
The electronic component is configured with a plating layer that includes an impregnation part impregnated into the internal conductor, enhancing the bonding strength between the external electrode and the plating layer, as well as between the external electrode and the internal conductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the element body is fired at high temperature to form the external electrode, then the external electrode flows and the surface becomes smooth, but the bonding strength between the external electrode and plating layer decreases
Solution Approach 1:
The patent applies preliminary plating treatment to the external electrode before the high-temperature firing process. The plating layer is formed on the external electrode surface in advance, so that when the element body is fired at high temperature and the external electrode flows, the plating layer is already present to maintain bonding strength despite the surface becoming smooth.
2Stability of the object's composition
If resin is contained in the internal conductor to match shrinkage rates, then crack occurrence is suppressed, but cavities form during firing which weakens bonding strength
Solution Approach 1:
The patent introduces an external electrode as an intermediary layer between the internal conductor and the plating layer. The external electrode covers the internal conductor and provides a bonding interface for the plating layer, so that even when cavities form due to resin burnout in the internal conductor, the external electrode maintains the bonding strength and prevents conduction failures.
3Shape
If the external electrode surface is smooth, then the appearance is improved, but it becomes difficult to increase bonding strength with plating layer
Solution Approach 1:
The plating layer is applied to the external electrode surface before the high-temperature firing process that causes surface smoothing. By performing the plating treatment in advance, the bonding interface is established when the surface still has adequate roughness, and the subsequent firing process does not compromise this pre-formed bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The impregnation of the plating layer into the internal conductor increases the bonding strength, preventing conduction failures and ensuring reliable electrical connections.
Implementation Method 1
the plating layer includes an impregnation part that is impregnated into the internal conductor
Implementation Method 2
the resin contained in the internal conductor burns out in the firing process of an element body in which the internal conductor is formed
Data Source
AI summary
To provide electronic component in which bonding strength between external electrode and plating layer and bonding strength between external electrode and internal conductor can be increased. Electronic component according to present disclosure includes element body, interlayer connection conductor provided inside element body so as to extend to main surface of element body, external electrode formed on main surface of element body so as to cover interlayer connection conductor, and plating layer covering external electrode. Plating layer includes impregnation part that is impregnated into interlayer connection conductor.