Component Pressing Assembly With FBG Sensing Near the Process Zone
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Solution Overview
Problem
Current component processing technologies face challenges in accurately monitoring and controlling pressure and temperature conditions during sintering and encapsulation processes, especially near the actual process region, due to limitations in sensor compactness, accuracy, and reliability under high pressure and temperature conditions.
Innovation Solution
Integration of Fiber Bragg Grating (FBG) strain and temperature sensors into the component processing apparatus, mechanically attached and thermally isolated to provide real-time strain and temperature measurements, allowing for precise force monitoring and process optimization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional sensors are used for pressure and temperature monitoring during sintering and encapsulation processes, then the apparatus can perform basic monitoring, but the measurement accuracy and reliability under high pressure and temperature conditions deteriorates
Solution Approach 1:
The patent replaces conventional mechanical/electrical pressure and temperature sensors with Fiber Bragg Grating (FBG) optical sensors. The FBG strain sensor mechanically attached to the displaceable member measures strain proportional to applied pressure, while the FBG temperature sensor thermally coupled to the member measures temperature, both using optical measurement principles that are immune to electromagnetic interference and suitable for harsh environments.
Solution Approach 2:
The patent introduces FBG optical fibers as intermediary sensing elements that indirectly measure pressure and temperature through strain and thermal coupling with the displaceable member. This intermediary approach allows measurement of process conditions without direct contact between sensors and the harsh high-pressure, high-temperature environment, thereby improving reliability.
2Measurement precision
If sensors are placed close to the actual process region for accurate monitoring, then measurement accuracy improves, but sensor compactness and suitability for high pressure/temperature conditions becomes more difficult to achieve
Solution Approach 1:
The patent employs FBG optical fibers that serve multiple functions: the same optical fiber can contain both strain sensors for pressure measurement and temperature sensors for thermal monitoring. This multi-functionality reduces the number of separate sensing devices needed and simplifies the overall sensor system while providing comprehensive process monitoring close to the process region.
Solution Approach 2:
The patent uses thin FBG optical fiber sensors that can be easily integrated into the displaceable member structure. The flexible nature of optical fibers allows them to be positioned close to the process region and mechanically attached or thermally coupled to the displaceable member without adding significant complexity or interfering with the high-pressure, high-temperature environment.
3Extent of automation
If real-time pressure monitoring is implemented using displaceable members, then process control capability improves, but the complexity of the apparatus increases
Solution Approach 1:
The patent implements feedback control by using FBG strain sensors attached to displaceable members to measure applied pressure in real-time. The optical signals from the FBG sensors provide direct feedback on the force exerted by each displaceable member, enabling monitoring and control of the sintering and encapsulation processes. This feedback mechanism enhances automation without requiring complex additional hardware.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and accurate monitoring of pressure and temperature conditions, enhancing process control and malfunction detection, ensuring consistent bonding and encapsulation quality by providing precise feedback under high-pressure and high-temperature conditions.
Implementation Method 1
Each FBG strain sensor is configured and arranged mechanically attached to the respective apparatus part to allow measuring strain of the respective apparatus part
Implementation Method 2
Each FBG temperature sensor is configured and arranged thermally in contact with the respective apparatus part to allow measuring temperature of the respective apparatus part
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3a~3b
AI summary
A component processing apparatus defines at least one component holding position for holding a component, such as comprising a semiconductor die, a substrate, a cooling plate, a package, an inverter casing, a spacer, etcetera, and comprises at least one displaceable member associated with each component holding position. Each displaceable member is configured and arranged to allow exerting force on a component held in the associated component holding position. The component processing apparatus comprises at least one apparatus part that is susceptible to strain induced by force, in use, exerted by the at least one displaceable member on the respective component(s) held in the component holding position(s), and that has a Fiber Bragg Grating, FBG, strain sensor. The FBG strain sensor is configured and arranged mechanically attached to the respective apparatus part to allow measuring strain of the respective apparatus part as induced by force, in use, exerted by the at least one displaceable member on the respective component(s).