Component Composite Singulation by Base Material Removal

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Solution Overview

Problem

Existing methods for singulating optoelectronic semiconductor components from a component composite, such as sawing, are complex and require additional support foils, limiting flexibility in processing direction.

Innovation Solution

A method involving a structured substrate with component carrier bodies and connecting portions, where the connecting portions are embedded in a base material, allowing for the removal of the base material in separating regions to facilitate singulation through less complex methods like punching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If sawing is used for singulation, then separation can be achieved, but the process becomes complex requiring support foils and has limited processing direction flexibility

Engineering Contradiction:

Improvesingulation process complexityVSAvoidseparation quality

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The base material is selectively removed in separating regions to create through-thickness gaps between adjacent component carrier bodies, dividing the composite into separable individual components. This segmentation enables simple punching methods to effectively separate components without requiring complex sawing processes or support foils.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The thickness parameter of the component composite is locally reduced in separating regions by removing the base material, creating through-thickness gaps. This parameter change transforms the thick composite into a thinner structure at separation lines, enabling less complex separation methods like punching to work effectively.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If base material is removed in separating regions, then singulation becomes simpler and faster, but the structural integrity during processing must be maintained

Engineering Contradiction:

Improvesingulation speedVSAvoidcomposite structural integrity

Core Design Contradiction:

ProductivityVSStrength

Solution Approach 1:

The base material is removed in separating regions before the actual singulation step, preliminarily preparing the component composite for easy separation. This preliminary action creates through-thickness gaps that enable subsequent punching or breaking operations to proceed quickly and easily without compromising the integrity of the component carrier bodies during processing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The base material is selectively removed only in separating regions while leaving it intact in other areas, creating local quality differences. This localized removal maintains structural integrity in regions where base material is needed for support while enabling easy separation in regions where base material has been removed.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12288830B2Method for singulating components from a component composite, and component

Publication Date: 2025.04.29 OSRAM OPTO SEMICON GMBH & CO OHG

AI summary

In an embodiment a method for singulating components from a component composite includes providing the component composite comprising a structured substrate including component carrier bodies and connecting portions arranged between the component carrier bodies, and a base material, in which the connecting portions of the structured substrate are at least partially embedded, removing the base material in separating regions of the component composite, which include the connecting portions and singulating the component composite at the separating regions to form the components.