Component Stack Mounting Structure for Electronic Devices
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Solution Overview
Problem
Existing electronic device mounting technologies face limitations in space utilization due to the large size of components like connectors and sensors, leading to inefficient use of mounting space and potential electrical disconnection issues.
Innovation Solution
A component stack mounting structure that includes a supporting member surrounding the component connector, allowing for stacked mounting of components and utilizing peripheral spaces for additional components or sound channels, while maintaining electrical connectivity through strategically designed adhesive members and substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If components are arranged on the same plane, then the device structure is simple, but the space utilization efficiency degrades
Solution Approach 1:
The patent transitions from planar mounting to three-dimensional stacked mounting. The sensor module is positioned above the connector module in the vertical dimension, allowing components to occupy different height levels rather than competing for the same planar space. This dimensional transition enables both components to coexist within the same footprint area, significantly improving space utilization efficiency.
Solution Approach 2:
The sensor module is nested above the connector module, with the supporting member extending down to surround the connector module. This nesting arrangement allows the sensor module to be positioned within the vertical space above the connector, creating a compact stacked configuration that maximizes space utilization while maintaining structural integrity.
2Reliability
If large-size components are mounted, then the required function is achieved, but the mounting space required increases
Solution Approach 1:
By utilizing the vertical dimension for stacking, the patent allows large-size components to be mounted without increasing the planar footprint. The connector module and sensor module are arranged in the vertical direction, enabling both components to maintain their required sizes while occupying minimal horizontal space.
Solution Approach 2:
The supporting member is designed with flexible height adjustment capability, allowing it to adapt to different component sizes and mounting requirements. This dynamic design enables the supporting member to provide adequate support for large-size components while maintaining compact overall dimensions.
3Area of stationary object
If components are placed close together to save space, then space efficiency improves, but electrical disconnection risk increases
Solution Approach 1:
The supporting member acts as an intermediary structure between the connector module and sensor module. It provides mechanical support and positioning that maintains appropriate spacing and alignment, preventing electrical disconnection while enabling compact stacked mounting. The supporting member's structure ensures stable electrical connections by preventing excessive movement or misalignment.
4Area of stationary object
If peripheral space is utilized for additional components, then space utilization improves, but device complexity increases
Solution Approach 1:
The supporting member serves multiple functions: it supports the sensor module, surrounds and protects the connector module, provides positioning features, and creates defined mounting areas for additional components. This multi-functionality allows peripheral space to be utilized effectively without proportionally increasing device complexity, as the same structural element performs multiple roles.
Data Source
AI summary
An electronic device according to various embodiments may include a display, a main board, a component connector, a supporting member, and a sensor module. The main board is disposed under the display. The component connector is disposed on a surface of the main board. The supporting member is configured to surround at least two side surfaces of the component connector and is disposed on the surface of the main board. The sensor module includes a sensor that faces at least a portion of the component connector. The sensor module also includes a sensor substrate that is stacked with the sensor and attached to the supporting member. The sensor substrate may be separably connected to the supporting member.