Electronic Component Mounting on Complex 3D Surfaces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for applying electronic components to complex 3D-shaped surfaces face challenges in accuracy and reproducibility, often resulting in inadequate solder placement and increased production costs due to the Tombstone Effect and joint failures.
Innovation Solution
A method involving a component stencil and a contact material stencil is used to precisely position and apply electronic components, ensuring accurate placement and adequate solder amount, utilizing a support that can conform to complex surfaces and allowing for precise application of solder paste or conductive adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional SMT methods are used to mount electronic components on complex 3D-shaped surfaces, then production efficiency is improved, but manufacturing precision deteriorates resulting in inadequate solder placement and component misalignment
Solution Approach 1:
The patent divides the mounting process into two distinct stages: first placing components on a flat support using conventional SMT methods, then transferring the entire assembly to the complex 3D surface. This segmentation allows each stage to be optimized independently - the first stage achieves high precision on a flat surface, while the second stage handles the complex geometry through formable support adaptation.
Solution Approach 2:
The patent performs preliminary component mounting on a flat support before final transfer to the complex surface. This preliminary action allows conventional high-precision SMT equipment to be used in optimal conditions, avoiding the precision problems that would occur if components were mounted directly on the complex 3D surface.
2Reliability
If solder amount is increased to ensure adequate joint strength, then reliability improves, but harmful effects worsen due to solder leakage and warping causing Tombstone Effect and soldering failure
Solution Approach 1:
The patent applies a formable support beneath the components before soldering, which cushions and absorbs the warping forces during reflow soldering. This preliminary protective measure prevents the Tombstone Effect and solder leakage by providing mechanical support that compensates for thermal expansion and component warping.
Solution Approach 2:
The formable support acts as an intermediary between the complex 3D surface and the electronic components. It provides a stable, flat mounting surface during soldering while adapting to the complex underlying geometry, thereby mediating the conflicting requirements of adequate solder amount and prevention of soldering defects.
3Adaptability or versatility
If components are mounted directly on complex 3D surfaces, then adaptability improves for retrofitting applications, but manufacturing precision deteriorates due to difficulty in achieving accurate solder placement
Solution Approach 1:
The patent segments the mounting process into component placement on flat support, followed by transfer to complex surface. This allows conventional precision SMT equipment to work in its optimal flat-surface environment, while still achieving adaptability to complex geometries through the transfer step and formable support adaptation.
Solution Approach 2:
The patent uses a formable support that can be shaped to conform to complex 3D surfaces. This flexible support maintains a flat mounting surface for precision component placement while adapting to the complex underlying geometry, thereby enabling retrofitting applications without sacrificing solder placement accuracy.
Data Source
Figure 1a~1b
Figure 1c~1e
Figure 2a~2b
AI summary
The invention relates to a method for applying at least one electronic component to a surface. The object to provide a method for reliably applying electronic components to a surface, in particular to complex surfaces of 3D-shaped objects, for avoiding solder smearing and for increasing solder-location accuracy and reproducibility as well as allowing to obtain optical properties desirable for retrofitting applications, is solved in that the method comprises: placing a component stencil on a support, wherein the component stencil comprises at least one opening corresponding to an electronic component; arranging at least one electronic component in the corresponding opening of the component stencil; positioning a contact material stencil on the component stencil, wherein the contact material stencil comprises at least one opening corresponding to at least one contact region of the at least one electronic component; applying a contact material on the at least one contact region of the at least one electronic component arranged in the corresponding opening of the contact material stencil; and applying the at least one electronic component to the surface, wherein the contact material connects the at least one electronic component to the surface. The invention further relates to a system for use in the inventive method and an electronic device.