Component-Incorporated Substrate Layout for Flatness and Downsizing
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Solution Overview
Problem
Existing component-incorporated substrates face challenges in achieving downsizing while maintaining substrate flatness around electronic components, as the space required for forming a frame-like section limits further miniaturization and can lead to surface deformation and mounting defects.
Innovation Solution
A multi-layer substrate structure with printed wiring base members laminated via an adhesive layer, where the wiring patterns are intensively disposed in a frame shape around the opening, with specific spacing and positioning to ensure flatness and prevent adhesive flow-induced recesses, eliminating the need for a conventional frame-like section.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a frame-like section is formed to surround the opening for housing electronic components, then flatness of the substrate surface in the periphery of the opening can be well secured, but the space required for the frame-like section prevents further downsizing of the substrate
Solution Approach 1:
The patent extracts the frame-like section from the conductive layer and relocates it to the adhesive layer position. By forming the frame-like section as a protrusion in the adhesive layer rather than as part of the conductive layer, the opening can be positioned directly over the conductive layer without requiring additional space for a separate frame structure, thereby achieving downsizing while maintaining flatness
Solution Approach 2:
The patent transitions the frame-like section from a two-dimensional planar feature in the conductive layer to a three-dimensional protrusion extending vertically from the adhesive layer. This dimensional change allows the frame function to be achieved through vertical protrusion rather than horizontal expansion, reducing the substrate area required
2Area of stationary object
If the opening size is reduced to achieve downsizing, then substrate compactness is improved, but positioning accuracy of the electronic component within the opening becomes more difficult to maintain
Solution Approach 1:
The patent forms the frame-like section protrusion in the adhesive layer before mounting the electronic component. This preliminary formation of the positioning structure allows the opening to be precisely positioned relative to the conductive layer patterns, ensuring accurate component placement even in reduced-size openings
Solution Approach 2:
The frame-like section protrusion in the adhesive layer serves as an intermediary positioning structure between the opening and the conductive layer. This intermediary feature provides mechanical support and positional reference, enabling precise component placement in smaller openings without requiring larger tolerance margins
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for overall downsizing of the substrate while maintaining flatness and reducing mounting defects, as the adhesive layer is uniformly filled, and the substrate surface remains flat, preventing recesses and enhancing the substrate's mechanical strength.
Implementation Method 1
an adhesive layer, the wiring patterns being intensively disposed in a frame shape around the opening... the adhesive layer is effectively managed to fill gaps without causing surface deformation
Implementation Method 2
batch-laminated by thermo-compression bonding... a plurality of printed wiring base members are batch-laminated via an adhesive layer
Data Source
AI summary
A component-incorporated substrate of multi-layer structure includes: a plurality of printed wiring base members that are batch-laminated via an adhesive layer, with the plurality of printed wiring base members including a resin base member that includes a wiring pattern on at least one surface thereof and a via connected to the wiring pattern; an opening disposed in at least one printed wiring base member that is sandwiched on both sides by other printed wiring base members of the plurality of printed wiring base members; and an electronic component disposed in the opening. At least part of the wiring pattern of the printed wiring base member where the opening is formed is disposed in a frame shape surrounding the opening, in a periphery of the opening.