Component Supply System Stationary Imaging Picking
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Solution Overview
Problem
Existing component supply systems for automated assembly apparatuses face inefficiencies in component delivery and configuration, particularly when handling components in bulk states, as they often require separate imaging and picking regions, leading to potential component movement issues and increased system complexity.
Innovation Solution
The proposed component supply system integrates a component delivery device that allows for imaging and picking of components on a stationary support surface, enabling reliable holding and compact system design by maintaining the support surface in a stationary state during imaging and picking, and includes a feeder-type component supply device with a vibration mechanism to disperse components, facilitating efficient delivery without significant changes to the automated assembly apparatus configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate imaging and picking regions are used, then imaging accuracy is improved, but component movement occurs and system complexity increases
Solution Approach 1:
The patent combines the imaging function and picking function into a single integrated region. The imaging device images the component support surface, and the picking device picks components from the same surface without requiring separate regions. This integration eliminates component movement between imaging and picking while maintaining imaging accuracy through coordinated positioning.
2Measurement precision
If separate imaging and picking regions are used, then imaging accuracy is improved, but device complexity increases
Solution Approach 1:
The patent merges the imaging device and picking device into a coordinated system operating within the same region. The imaging device captures component positions, and the picking device uses this information to pick components directly from the imaged locations. This integration reduces the number of separate subsystems and simplifies the overall system configuration while maintaining imaging capability.
3Manufacturing precision
If component support surface is moved after imaging, then picking position is improved, but component movement occurs
Solution Approach 1:
The patent performs imaging of the component support surface before the picking operation begins. The imaging device captures the positions and orientations of components on the support surface, and this imaging data is used to guide the picking device. By completing imaging preliminarily and using the captured data for picking, the system ensures that components remain in their original positions throughout the process, eliminating position instability.
4Measurement precision
If imaging and picking are performed separately, then each function is optimized, but assembly efficiency decreases
Solution Approach 1:
The patent implements a continuous workflow where imaging and picking operations are performed in sequence without interruption. The imaging device continuously captures component information, and the picking device continuously picks components based on the imaging data. This continuous operation eliminates idle time and maintains high productivity while ensuring imaging quality through proper timing and coordination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability and efficiency of component delivery by ensuring accurate holding and reduces system complexity, allowing for compact design and minimal changes to the automated assembly apparatus, thereby improving the overall assembly process.
Implementation Method 1
a feeder-type component supply device with a vibration mechanism to disperse components
Data Source
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AI summary
To improve utility of a component supply system which supplies components in a bulk state to a component receiving section of an automated assembly apparatus. When a component support member 150 is moved forward with respect to a component feeder 82, the component feeder 82 is vibrated, and the components are discharged from the component feeder 82 on a component support surface 198 and are supported in a dispersed state. An imaging device 90 moves in a lateral direction, images a plurality of components on the component support surface 198 all at once, and a suction nozzle of a component holding head 300 holds a component 480 with a lead in a state appropriate to be held. The suction nozzle is rotated and pivoted to insert the component 480 in a component receiving member 460 of one of component carriers 450 and 452 that is positioned at a component receiving position, with the lead oriented downward. The component carrier which receives the component 480 is moved to a component delivery position, and the component 480 is delivered to a mounting head of an electronic circuit assembly apparatus. The component 480 which remains on the component support surface 198 is returned to a component feeder 82 by the component return device 88.