Electronic Component Taking Out Apparatus Using Reference Mark Positioning
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Solution Overview
Problem
Existing electronic component taking out apparatuses face challenges in precision when components are not uniformly arranged in a wafer or when the wafer holding section is deformed, as they rely on reference marks that can be inaccurate due to non-uniform arrangements or material deformation.
Innovation Solution
A surface mounting apparatus that includes an electronic component taking out apparatus with a component transfer head and a wafer camera, using marked reference electronic components positioned near the target component to calculate its precise location based on component arrangement information, allowing for accurate extraction even in distorted arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If reference marks on the wafer holding section are used to calculate component positions, then the positioning process is simple, but positioning precision deteriorates when components are non-uniformly arranged or the wafer holding section deforms
Solution Approach 1:
The patent uses image data captured by a camera to create a digital copy of the actual component positions on the wafer. This image-based positioning system replaces the physical reference mark system, allowing the system to detect and adapt to actual component locations even when they deviate from nominal positions or when the wafer holding section deforms.
Solution Approach 2:
The patent implements a feedback mechanism where the camera continuously monitors component positions, and the control unit adjusts positioning calculations based on detected deviations from nominal positions. This closed-loop system compensates for non-uniform arrangements and deformations by using real-time position data to correct positioning errors.
2Ease of operation
If reference marks are used for positioning, then the system is easy to operate, but positioning accuracy deteriorates due to wafer holding section deformation
Solution Approach 1:
The system creates an image-based copy of the wafer surface and component positions, replacing reliance on physical reference marks that are affected by deformation. This allows the system to easily operate with image data while achieving accurate positioning by detecting actual component locations in the captured images.
Solution Approach 2:
The patent replaces the mechanical reference mark system with an optical/image-based positioning system. The camera captures images of component positions, and the control unit processes these images to determine accurate positions, substituting mechanical reference structures with a more flexible optical measurement approach that is immune to physical deformation.
3Manufacturing precision
If image recognition is performed for all components, then positioning precision is improved, but processing time increases
Solution Approach 1:
The patent extracts and processes only the necessary image data for positioning purposes. The camera captures images of the wafer surface and components, and the control unit selectively processes image data to identify component positions, extracting only the relevant positional information needed for the positioning task rather than performing comprehensive analysis of all image features.
Solution Approach 2:
The system performs image recognition and processing at a level sufficient for positioning accuracy without over-processing. The camera captures images with adequate resolution and the control unit processes the essential positional information from these images, performing partial processing that achieves the required precision without the time cost of exhaustive analysis.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise extraction of electronic components from assemblies with non-uniform arrangements or deformed wafer holding sections by directly referencing the marked reference components, ensuring accurate positioning and mounting.
Implementation Method 1
a wafer camera for imaging the wafer held on the wafer holding section
Data Source
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AI summary
A plurality of reference electronic components (M1, M2) marked in advance are identified and recognized, and the positions of the plurality of the reference electronic components (M1, M2) positioned in the vicinity of an electronic component to be taken out (2a) and component arrangement information in a wafer mapping file (MF) stored in a storage device (11f) are used to calculate the position of the electronic component to be taken out (2a).