Component Temperature Control During Cross-System Transfer
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Solution Overview
Problem
Temperature control of sensitive components during transfer between systems is challenging due to thermal loads and drifts, leading to measurement inaccuracies in microlithography processes, where maintaining millikelvin precision is difficult and temperature stability is achieved slowly, resulting in errors from thermally induced refractive index variations and mechanical drifts.
Innovation Solution
A method that involves ascertaining expected temperature drifts by measuring the component's temperature before and after transfer and modifying the temperature in one or both systems to minimize this drift, using predictive models and adjusting thermal loads to compensate for thermal changes during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the replacement component is transferred from a separate holder into the measurement system, then the component can be exchanged for different measurements, but temperature drift occurs during transfer due to thermal loads from both systems
Solution Approach 1:
The patent applies preliminary action by pre-cooling the replacement component in the holder to the target temperature before transfer. Temperature sensors monitor the component's thermal state, and cooling elements actively maintain the desired temperature prior to exchange, preventing temperature drift during the transfer process itself.
Solution Approach 2:
The patent introduces an intermediary thermal management system that includes temperature sensors attached to the replacement component and cooling elements positioned to actively control its temperature. This intermediary system acts as a mediator between the holder's thermal environment and the measurement system's thermal requirements, maintaining temperature stability during transfer.
2Adaptability or versatility
If the replacement component is held in a separate holder with multiple components, then component selection and exchange is enabled, but thermal loads from the holder and measurement system cause temperature fluctuations
Solution Approach 1:
The patent extracts the temperature-sensitive replacement component from the thermal environment of the holder during critical measurement phases. By selectively removing only the needed component and maintaining it at the target temperature through active cooling, the harmful thermal loads from the holder are eliminated for that component.
Solution Approach 2:
Temperature sensors and cooling elements serve as intermediaries that protect the replacement component from harmful thermal loads. The sensors detect thermal deviations caused by holder thermal loads, and the cooling elements compensate for these effects, mediating between the holder's thermal environment and the component's temperature stability requirements.
3Stability of the object's composition
If the replacement component approaches target temperature over several hours due to time constant, then thermal equilibrium is eventually reached, but measurement productivity is reduced due to long waiting time
Solution Approach 1:
The patent applies preliminary action by performing active cooling of the replacement component to the target temperature before it is needed for measurement. This pre-cooling process, monitored by temperature sensors, eliminates the several-hour waiting period that would otherwise be required for natural thermal equilibrium, thereby maintaining temperature stability while dramatically improving measurement productivity.
Solution Approach 2:
The patent employs periodic action through cyclic cooling operations that actively maintain the replacement component at the target temperature. Rather than relying on slow passive thermal equilibrium, the system uses periodic cooling cycles controlled by temperature sensor feedback to rapidly achieve and maintain the desired thermal state, reducing waiting time while ensuring temperature stability.
4Extent of automation
If motors and handling systems are used for component transfer, then automated component exchange is achieved, but thermal loads from these systems cause heating and cooling of the component during transfer
Solution Approach 1:
The patent introduces temperature sensors and cooling elements as intermediaries that compensate for thermal loads generated by automated handling systems. The sensors monitor temperature changes caused by motor thermal radiation and handling operations, while the cooling elements actively counteract these effects, maintaining the replacement component's thermal state despite the presence of automated handling equipment.
Solution Approach 2:
The patent converts the harmful thermal loads from automated handling systems into a manageable parameter by using temperature sensors to detect and cooling elements to compensate for these effects. The thermal radiation from motors, which would otherwise cause unwanted heating, is measured and counterbalanced, transforming a harmful effect into a controlled variable that does not compromise temperature stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces temperature drifts and associated measurement errors by ensuring the component reaches the desired temperature stability quickly, enhancing the accuracy of microlithography processes by maintaining consistent thermal conditions during transfer and operation.
Implementation Method 1
a temperature sensor that is attached to the replacement component or with which the thermal state of the replacement component can be ascertained
Implementation Method 2
a cooling element that can act onto the replacement component or into the surroundings of the replacement component
Data Source
AI summary
A method for temperature control of a component that is transferable between a first system and a second system includes: ascertaining a temperature drift of a temperature of the component that is to be expected after transfer of the component from the first system into the second system; and modifying a temperature prevailing in the first system and/or a temperature prevailing in the second system such that the temperature drift that is actually occurring after transfer of the component from the first system into the second system is reduced with respect to the expected temperature drift.