Component-Level Thermal Control for Surface Temperature Prediction
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Solution Overview
Problem
Electronic devices face challenges in accurately controlling heat generation due to the difference between internal and surface temperatures, leading to performance deterioration or unacceptable standards.
Innovation Solution
A method is implemented to monitor current consumption for each component, predict surface temperatures, detect heat generation locations, and adjust power consumption to maintain a target temperature, using thermal resistance and capacitance modeling to analyze and control heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature information from a thermistor is used to control heat, then heat control is implemented, but the difference between internal and surface temperatures makes it difficult to accurately determine heat generation points and timing
Solution Approach 1:
The patent divides the electronic device into multiple components (processor, memory, communication module, etc.) and calculates heat generation for each component separately based on their respective power consumption characteristics. This segmentation allows precise identification of which specific component is generating heat, overcoming the limitation of using a single thermistor that cannot distinguish between different heat sources within the device.
Solution Approach 2:
The patent pre-stores power consumption characteristics and thermal resistance values for each component before operation. During runtime, it calculates predicted surface temperature by combining these pre-stored values with real-time power consumption data. This preliminary preparation enables rapid and accurate temperature prediction without requiring complex real-time thermal modeling, thus improving both measurement precision and control reliability.
2Temperature
If power consumption is reduced to control heat, then temperature is controlled, but performance may deteriorate
Solution Approach 1:
The patent applies heat control measures selectively to specific components that are generating excessive heat, rather than uniformly reducing power consumption across all components. By identifying the exact component causing the temperature issue and adjusting only its power consumption, the system maintains optimal performance for non-affected components while controlling temperature where necessary.
Solution Approach 2:
The patent dynamically adjusts power consumption based on real-time temperature predictions and actual thermal conditions. The system continuously monitors power consumption, predicts surface temperature, compares it with threshold values, and adaptively modifies component operation. This dynamic approach allows the device to maintain high performance when temperatures are acceptable while implementing targeted power reduction only when and where temperature control is needed.
Data Source
AI summary
A control method by an electronic device is provided. The control method includes monitoring current consumption for each of a plurality of components of the electronic device, predicting a first surface temperature of the electronic device and detecting a location where heat is generated, predicting a second surface temperature by analyzing power consumption of a component corresponding to the location where heat is generated, determining whether the predicted second surface temperature is greater than or equal to a predetermined temperature, setting a target temperature when the predicted second surface temperature is greater than or equal to the predetermined temperature, and controlling the component to reduce the power consumption.