Electronic Component Transfer on Curved Carriers Without Intermediates
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Solution Overview
Problem
Existing methods for transferring electronic components, especially miniaturized chips, face challenges in accuracy and throughput due to the fragility of components and the requirement for precise handling, and are limited by the need for transparent second carriers, which restricts the use of non-transparent materials.
Innovation Solution
An apparatus and method that transfers electronic components directly from a first carrier to a second carrier, using a separating device and conveying system to orient and place components with high accuracy, allowing for the use of non-transparent carriers and eliminating the need for intermediate handling, and incorporates heating to establish electrical connections between components and subassemblies on the second carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional transfer methods using intermediate carriers and transparent materials are used, then component handling is simplified, but throughput is reduced and manufacturing complexity increases
Solution Approach 1:
The patent removes the intermediate carrier from the transfer process, enabling direct transfer of electronic components from the first carrier to the second carrier. This extraction of the intermediate carrier simplifies the manufacturing process and increases throughput by eliminating an additional handling step and reducing the number of components required.
Solution Approach 2:
The separating device is designed to perform multiple functions: it separates components from the first carrier, transfers them directly to the second carrier, and establishes electrical connections through heating. This multi-functionality consolidates multiple operations into a single device, reducing manufacturing complexity and improving productivity.
2Manufacturing precision
If transparent second carriers are used, then component positioning accuracy is maintained, but material selection is restricted
Solution Approach 1:
The patent replaces optical detection methods (which require transparent carriers) with mechanical positioning and sensing systems. The separating device uses mechanical means to detect component positions and maintain placement accuracy regardless of carrier transparency, enabling the use of non-transparent materials while preserving manufacturing precision.
Solution Approach 2:
The invention changes the detection and positioning parameters from optical (light-based) to mechanical or electrical sensing methods. This parameter change allows the system to function with non-transparent carriers, expanding material selection flexibility while maintaining component placement accuracy through alternative sensing mechanisms.
3Reliability
If components are handled with great care to prevent damage, then component reliability is maintained, but transfer speed is reduced
Solution Approach 1:
The direct transfer mechanism enables continuous operation where components are separated and transferred in an uninterrupted sequence. The separating device processes multiple components continuously without the need to stop for intermediate carrier changes, maintaining component integrity through gentle yet efficient handling while maximizing transfer speed.
Solution Approach 2:
The separating device acts as a sophisticated intermediary that uses controlled mechanical or electromagnetic fields to handle components gently. This intermediary mechanism provides precise control over component interaction, preventing damage through carefully managed contact forces while enabling rapid transfer through automated, high-speed operation.
4Reliability
If intermediate carriers and adhesives are used, then component attachment is secured, but manufacturing complexity and cost increase
Solution Approach 1:
The patent eliminates the adhesive application step and intermediate carrier from the process. Components are transferred directly and attached through alternative mechanisms such as mechanical interlocking or direct bonding, removing the complexity of adhesive management while maintaining secure attachment through simplified process steps.
Solution Approach 2:
The separating device creates a direct transfer path that copies the component's position and orientation from the first carrier to the second carrier without requiring adhesive intermediaries. This direct copying mechanism maintains attachment security through precise positioning and direct contact methods, eliminating the need for additional adhesive application equipment and process steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases throughput and accuracy in component placement, enables the use of non-transparent carriers without compromising positional accuracy, and simplifies the manufacturing process by eliminating the need for intermediate carriers and adhesives, reducing complexity and cost.
Implementation Method 1
heating to establish electrical connections between components and subassemblies on the second carrier
Data Source
AI summary
A device configured to receive a first carrier with a first receptacle; to guide a second carrier in a conveying direction with a second receptacle; to receive the first carrier with the first receptacle so that the components carried by it are oriented towards the second receptacle; to separate the components in response to information from a control unit; and convey the second carrier in its position relative to a placement position so that an electronic subassembly on the second carrier reaches the placement position. The second receptacle has a contact surface for the second carrier which is curved in the conveying direction of the second carrier and the second receptacle at least partially includes a second conveying device which occupies only part of the second receptacle transversely to the conveying direction of the second carrier.