Electronic Component Transfer Device Gap Reduction Mechanism
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Solution Overview
Problem
Existing methods for transferring electronic components from one carrier to another often result in inaccurate placement, damage, and low throughput due to the risk of twisting and incomplete separation, especially with miniaturized components.
Innovation Solution
A device with a slider and gripper system that positions and translates the first carrier relative to a second carrier, using a cap to reduce the gap between them, and a gripper device to separate the component, ensuring precise placement and minimizing mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a cutting needle is used to eject the chip from the carrier film, then the chip can be detached from the carrier, but the chip may twist during detachment resulting in imprecise placement
Solution Approach 1:
The patent introduces a support structure that acts as an intermediary between the carrier film and the ejection mechanism. The support provides a stable base for the chip during the ejection process, preventing twisting and ensuring precise placement. The support structure includes positioning elements that maintain the chip's orientation and position throughout the transfer operation.
2Productivity
If the ejection needle does not touch the chip in the center or adhesive bond is non-uniform, then the chip can be detached, but twisting occurs leading to rejection
Solution Approach 1:
The patent incorporates feedback mechanisms including sensors that detect the position and orientation of the chip during the ejection process. This feedback allows the system to adjust the ejection force and positioning in real-time, ensuring that the chip is always ejected from its center regardless of adhesive variations, thereby maintaining high placement accuracy while preserving chip integrity.
3Productivity
If the gap between first carrier and second carrier is large, then components can be transferred, but the transfer distance increases the risk of damage and reduces throughput
Solution Approach 1:
The patent employs a multi-dimensional transfer mechanism where the support structure can move in multiple directions (vertical, horizontal, and rotational dimensions). This allows the system to minimize the transfer gap by adjusting the support position in three-dimensional space, reducing the risk of component damage while maintaining high throughput through efficient multi-axis positioning.
Data Source
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AI summary
The aim of the invention relates to a device for transferring electronic components from a first carrier to a second carrier. At least one slide is connected to a slide-actuator. A cap comprises a support, a slide channel for the at least one slide, and a gripping device for the first carrier. A first receiving portion is designed to position the first carrier on the support, wherein the electronic components are provided on a side of the first carrier, which faces away from the support. A second receiving portion is designed to position the second carrier. The first receiving portion and the second receiving portion are arranged with respect to each other in such a manner that a gap separates the first carrier from the second carrier. In addition, the cap and/or the second receiving portion are designed so that it is possible to move from a first position into a second position, so that the gap between the first carrier and the second carrier becomes smaller. The at least one slide is designed so that it can be moved by the at least one slide-actuator relative to the support, to lift the first carrier, which is applied against the support, away from the support, and to move an electronic component provided on the first carrier, in the direction of the second carrier. In addition, the gripper device is designed to convey the first carrier to the support, in order to separate the electronic component from the first carrier.