Electronic Component Transfer Inspection and Repair
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Solution Overview
Problem
Current mass transferring techniques for electronic components onto target substrates face inefficiencies and low yield rates, necessitating improvements in both process efficiency and component transfer reliability.
Innovation Solution
A method involving the inspection and repair of pickup sites on a transfer head, where empty or defective sites are identified and repaired by transferring additional electronic components, ensuring all sites are occupied before transferring the components onto a target substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mass transferring technique is used to transfer electronic components onto target substrate, then productivity is improved, but yield rate deteriorates
Solution Approach 1:
The patent applies preliminary action by inspecting pickup sites before the transfer process and removing defected electronic components from pickup sites prior to transfer. This ensures that only sound components are transferred to the target substrate, thereby improving yield rate while maintaining mass transfer efficiency. The inspection and cleaning of pickup sites is performed in advance to prevent defective components from compromising the overall transfer yield.
2Reliability
If pickup sites are inspected and repaired before transfer, then yield rate is improved, but process complexity increases
Solution Approach 1:
The patent implements self-service by enabling the transfer system to automatically inspect its own pickup sites and identify defected electronic components. The system performs self-diagnosis and self-correction by removing defective components from pickup sites before transfer, eliminating the need for external manual inspection and repair processes. This automated self-service approach improves yield rate without significantly increasing process complexity.
Data Source
AI summary
A method of manufacturing an electronic device including the following steps is provided herein. Providing a plurality of first electronic components on a first structure. Providing a plurality of receiving sites on a second structure. Performing a first transferring, including transferring at least portion of the plurality of first electronic components onto at least portion of the plurality of receiving sites on the second structure. Figuring out an empty receiving site from the plurality of receiving sites, wherein the plurality of first electronic components is absent at the empty receiving site. Performing a second transferring, including transferring a second electronic component onto the empty receiving site on the second structure. Providing a target substrate, and transferring the at least portion of the plurality of first electronic components and the second electronic component on the second structure onto the target substrate.