Electronic Component Turning via Suction and Vision Control
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Solution Overview
Problem
Existing electronic component manufacturing methods face challenges in reliably turning small-sized electronic component chips due to deformation of elastic members and difficulty in accurately applying conductive paste to all surfaces, especially when the size of the chips decreases.
Innovation Solution
An electronic component manufacturing apparatus and method utilizing a pair of plates with elastic layers and motor-driven movement mechanisms to precisely control the turning path of the chips, allowing for reliable turning and paste application to both end faces, even for small chips, by using a planar movement mechanism and a vertical movement mechanism in conjunction with torque detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If elastic members are used to hold and turn electronic component chips, then the chips can be held and turned for paste application, but the elastic members deform making it difficult to accurately turn small-sized chips
Solution Approach 1:
The patent replaces the elastic member-based mechanical holding system with a suction-based holding system. The suction holding table uses vacuum suction to hold chips, and the suction holding clamp uses suction to grip and turn chips, eliminating the deformation problems associated with elastic members. This substitution maintains ease of operation while significantly improving turning accuracy for small-sized chips.
Solution Approach 2:
The patent employs vision recognition systems that capture images of the chips and their positions, then use this visual information to guide the suction holding clamp in accurately locating and turning each chip. The system creates a digital copy of the chip positions and uses this information to achieve precise turning without relying on the mechanical properties of holding devices.
2Productivity
If the size of electronic component chips decreases, then more chips can be processed in smaller spaces, but it becomes difficult to accurately turn and apply paste to all surfaces
Solution Approach 1:
The vision recognition system captures images of small-sized chips and their positions on the processing table, then uses this visual information to guide the suction holding clamp in accurately locating, gripping, and turning each chip. This allows the system to maintain high precision in turning and paste application even as chip sizes decrease, enabling increased processing capacity without sacrificing accuracy.
Solution Approach 2:
The patent replaces traditional mechanical holding and turning mechanisms with a suction-based system controlled by vision recognition. The suction holding clamp can accurately grip and turn small-sized chips through suction force combined with vision-guided positioning, eliminating the difficulty of accurately manipulating smaller chips with conventional mechanical systems.
3Device complexity
If conventional turning methods are used, then the process is simple, but it is difficult to reliably turn small-sized chips and apply paste to both end faces
Solution Approach 1:
The vision recognition system creates a digital representation of each chip's position, orientation, and dimensions, then uses this information to guide the suction holding clamp in reliably turning each chip to the correct orientation for paste application. This ensures reliable turning and paste application to both end faces, overcoming the limitations of simple conventional methods when processing small-sized chips.
Solution Approach 2:
The patent replaces simple mechanical turning methods with a suction-based holding and turning system. The suction holding clamp reliably grips chips through suction force and turns them to the correct orientation using vision-guided control, significantly improving the reliability of chip turning and paste application compared to conventional simple mechanical methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and precise turning of electronic component chips, ensuring proper application of conductive paste to both end faces, even for small-sized chips, by controlling the movement of the plates along a predetermined turning path and detecting motor torque for precise control.
Implementation Method 1
a first elastic layer (14) formed on a lower surface of the support plate portion (13)
Implementation Method 2
one surface of the electronic component chip (1) adhering, at the other surface being in contact with the second plate (15)
Data Source
AI summary
An electronic component manufacturing method includes the steps of preparing at least one electronic component chip having a first surface and a second surface opposite each other; holding the electronic component chip between a first plate and a second plate such that the first surface is in contact with a first elastic layer of the first plate and the second surface is in contact with a second elastic layer of the second plate; and turning the electronic component chip by relatively moving the first and second plates in a planar direction thereof using a planar movement mechanism and moving the first and second plates in accordance with a turning path of the electronic component chip using the planar movement mechanism and a vertical movement mechanism.