Composite Adhesive Layer for Laminate Bonding
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Solution Overview
Problem
Current adhesives often lack adequate initial green bond strength and require longer than desired bonding time, making them inefficient for forming laminate structures with sufficient bonding properties.
Innovation Solution
A composite adhesive layer is formed by combining a hot melt adhesive with another adhesive, providing both initial green bond strength and final bond strength, allowing for faster manufacturing processes without the need for sustained compressional loads during curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a water-based adhesive is used, then the final bond strength can be adequate, but the initial green bond strength is insufficient and bonding time is extended
Solution Approach 1:
The adhesive system is segmented into two distinct adhesive layers: a first adhesive layer providing immediate green bond strength, and a second adhesive layer providing final cured bond strength. This segmentation allows each adhesive to be optimized for its specific function, resolving the contradiction between initial and final bond strength requirements.
Solution Approach 2:
The first adhesive layer performs preliminary bonding action immediately upon application, holding substrates together before the second adhesive layer cures. This preliminary action eliminates the need for sustained compressional loads during curing and enables faster manufacturing cycles.
2Strength
If a hot melt adhesive is used, then initial green bond strength is provided, but final bond strength may be insufficient and chemical fumes are generated
Solution Approach 1:
Different regions of the adhesive system have different qualities: the first adhesive layer (hot melt) is located where immediate bond strength is needed, while the second adhesive layer (water-based) is located where final bond strength is needed. This local differentiation allows each adhesive to perform its specific function optimally.
Solution Approach 2:
The patent minimizes the amount of hot melt adhesive used (converting its harmful fume-generating property into a beneficial localized function) while using water-based adhesive as the primary bonding agent. The hot melt adhesive's immediate bonding capability is harnessed briefly, then its application is reduced to minimize fumes.
3Device complexity
If a single adhesive is used, then the adhesive system is simple, but it cannot provide both adequate initial green bond strength and fast setting final bond strength
Solution Approach 1:
The composite adhesive system performs multiple functions: the first adhesive layer provides immediate green bond strength and initial substrate holding, while the second adhesive layer provides final cured bond strength. This multi-functionality enables faster manufacturing without requiring sustained compression during curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite adhesive layer achieves efficient and reliable bonding characteristics, enabling faster production of articles with superior or similar bond strengths compared to using either adhesive alone, while minimizing chemical fumes and costs associated with the first adhesive.
Implementation Method 1
the first adhesive can include a hot melt adhesive... the first adhesive can provide a suitable initial green bond strength
Implementation Method 2
a second adhesive that can provide a suitable final (fully set or cured) bond strength
Data Source
AI summary
An article includes a substrate including a bonding surface area, a first adhesive disposed on the bonding surface area in a first discrete pattern, the first adhesive comprising a hot melt adhesive, and a second adhesive disposed on the bonding surface area in a second discrete pattern that is complementary to the first discrete pattern, wherein the first discrete pattern comprises about 1% to about 25% of the bonding surface area and the second discrete pattern comprises a balance of the bonding surface area.