Composite Base Plate Thermal Conductivity Weight Reduction

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Solution Overview

Problem

Conventional spacecraft base plates made of metal, such as aluminum, are heavy and limit the number of electronics packages that can be carried due to their weight, necessitating a solution that provides both structural strength and thermal conductivity while reducing weight.

Innovation Solution

A high thermal conductivity composite baseplate (HTCCB) composed of boron and carbon fiber layers with carbon nanotubes (CNTs) embedded between them, acting as a structural support and efficient heat conductor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If metal base plates (such as aluminum) are used to provide structural strength and thermal conductivity, then structural strength and thermal conductivity are improved, but weight increases

Engineering Contradiction:
Improvestructural strengthVSAvoidbase plate weight
Core Design Contradiction:
StrengthVSWeight of moving object

Solution Approach 1:

The patent applies composite materials by combining carbon fiber-reinforced polymer matrix composite (CFRP) layers with aluminum alloy layers to create a hybrid base plate. The CFRP layers provide high strength-to-weight ratio while the aluminum layers provide thermal conductivity and structural support. This composite structure achieves both structural strength and thermal conductivity requirements while significantly reducing weight compared to solid metal base plates.

Inventive Principle:
Principle #40Composite materials

2Temperature

If metal base plates (such as aluminum) are used to ensure thermal conductivity, then heat transfer capability is improved, but weight increases

Engineering Contradiction:
Improveheat transfer capabilityVSAvoidbase plate weight
Core Design Contradiction:
TemperatureVSWeight of moving object

Solution Approach 1:

The hybrid composite base plate incorporates aluminum alloy layers specifically to provide thermal conductivity pathways while using CFRP layers to minimize weight. The aluminum layers act as thermal conduits that efficiently transfer heat from electronic packages to heat pipes, while the overall composite structure maintains weight below that of traditional solid aluminum base plates.

Inventive Principle:
Principle #40Composite materials

3Strength

If thicker metal base plates are used to increase structural strength, then structural strength is improved, but weight increases

Engineering Contradiction:
Improvestructural strengthVSAvoidbase plate thickness
Core Design Contradiction:
StrengthVSLength of moving object

Solution Approach 1:

The composite base plate achieves required structural strength with reduced thickness by utilizing the high strength-to-weight ratio of CFRP materials. The layered composite structure provides structural rigidity and strength comparable to or exceeding solid metal plates of greater thickness, while maintaining a thinner overall profile and significantly lower weight.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The HTCCB offers significant weight reduction while maintaining structural strength and thermal conductivity, enabling increased payload capacity by efficiently transferring heat from electronics packages to heat-pipes, thus overcoming the weight limitations of traditional metal base plates.

Implementation Method 1

carbon nanotube ('CNT') material attached between the first boron and carbon fiber layer and the second boron and carbon fiber layer where the CNT material includes a plurality of CNTs within the CNT material

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3072680B1High thermal conductivity composite base plate and output multiplexer chassis
Publication Date: 2019.11.06 THE BOEING CO
  • EP3072680B1 patent drawingFigure 1
  • EP3072680B1 patent drawingFigure 2
  • EP3072680B1 patent drawingFigure 3A~3B

AI summary

Disclosed is a high thermal conductivity composite baseplate ("HTCCB") for use with an electronics package on a vehicle. The HTCCB may include a first boron and carbon fiber layer and a second boron and carbon fiber layer. Additionally, the HTCCB may also include a carbon nanotube ("CNT") material bonding the first boron and carbon fiber layer to the second boron and carbon fiber layer and a plurality of CNTs within the CNT material.