Composite Board Manufacturing System for Flexible PCBs
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Solution Overview
Problem
The existing manufacturing process for flexible printed circuit boards (FPCBs) faces challenges due to the difference in tack time between the pre-bonding and hot-pressing processes, leading to defects such as sagging and inability to continuously supply the boards for hot-pressing.
Innovation Solution
A composite board manufacturing system that automates the pre-bonding and hot-pressing processes into a continuous roll-to-roll method, utilizing a coverlay supply apparatus, printed circuit board supply apparatus, pre-bonding apparatus, hot-press apparatus, and transfer apparatus to unify these processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pre-bonding process is performed separately from the hot-pressing process, then the coverlay can be pre-bonded to the printed circuit board, but the difference in tack time causes the printed circuit board to sag and defects occur
Solution Approach 1:
The patent combines the pre-bonding process and hot-pressing process into a single integrated apparatus. The coverlay is pre-bonded to the printed circuit board and then hot-pressed in the same device without transfer, eliminating the time delay that causes sagging and maintaining board flatness while ensuring bonding quality.
Solution Approach 2:
The patent implements a continuous process where the printed circuit board moves continuously through the pre-bonding and hot-pressing zones without stopping or being transferred. This continuous action eliminates idle time and maintains the board in a controlled state, preventing sagging while ensuring both bonding quality and manufacturing precision.
2Ease of manufacture
If the printed circuit board is stored in roll form between pre-bonding and hot-pressing, then the processes can be separated, but productivity is lowered due to manual handling and storage operations
Solution Approach 1:
The patent eliminates the storage and manual handling steps by implementing a continuous process where the printed circuit board moves directly from pre-bonding to hot-pressing without interruption. This continuous operation maximizes productivity while the integrated design maintains sufficient flexibility for the manufacturing process.
Solution Approach 2:
The patent extracts the storage and manual handling operations from the manufacturing process by integrating pre-bonding and hot-pressing into a single continuous operation. This removes the non-value-added steps that reduced productivity while preserving the essential manufacturing flexibility through the modular design of the integrated apparatus.
3Adaptability or versatility
If the pre-bonding process time is 30 to 60 seconds and hot-pressing process time is 240 to 300 seconds, then each process can be optimized independently, but the tack time difference prevents continuous transfer
Solution Approach 1:
The patent designs the integrated apparatus with separate heating zones that operate simultaneously along the continuous path. The pre-bonding zone operates for 30-60 seconds while the hot-pressing zone operates for 240-300 seconds, with both zones processing different sections of the board at the same time. This allows independent optimization of each process while maintaining continuous manufacturing capability.
Solution Approach 2:
The patent transitions from a sequential process (one after another) to a spatially distributed parallel process. Different process zones are arranged along the length of the apparatus, allowing multiple processes to occur simultaneously at different positions, thereby resolving the time conflict between pre-bonding and hot-pressing while maintaining continuous production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the continuous and automatic manufacturing of composite boards with improved productivity by eliminating the need for storage and manual handling, thereby reducing defects and enhancing the efficiency of the manufacturing process.
Implementation Method 1
pre-bonding process
Implementation Method 2
pre-bonding process
Implementation Method 3
hot-pressing process
Implementation Method 4
hot-pressing process
Data Source
Figure 1
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AI summary
The present invention relates to a system for manufacturing a printed circuit board, comprising: a coverlay supply apparatus for supplying a coverlay; a printed circuit board supply apparatus for supplying a printed circuit board; and a tack-welding apparatus for discharging a first composite board by tack-welding the coverlay supplied from the coverlay supply apparatus onto the printed circuit board supplied from the printed circuit board supply apparatus.