Composite Bond Wire Structure for Lower-Cost Conductivity
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Solution Overview
Problem
The high cost of gold bond wires in electronic devices due to their expensive nature, despite being preferred for low resistance and good electrical and thermal conductivity, necessitates the exploration of alternative materials without compromising conductivity characteristics.
Innovation Solution
A bond wire with a thermoplastic core made from recycled materials blended with conductive fillers, surrounded by a conductive outer layer, such as gold, to enhance electrical and thermal conductivity while reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If gold is used for bond wires, then electrical and thermal conductivity is improved, but cost increases
Solution Approach 1:
The patent applies composite materials by combining a thermoplastic core material with conductive filler particles (such as metal powders, carbon, or graphene) to create a bond wire that achieves the desired electrical and thermal conductivity without using pure gold. The composite structure allows the non-conductive thermoplastic to be enhanced by the conductive fillers, resolving the contradiction between cost and conductivity.
Solution Approach 2:
The patent changes the material parameters by transitioning from a pure metal (gold) to a composite material system where the conductivity can be tuned by adjusting the type, amount, and distribution of conductive fillers within the thermoplastic matrix. This parameter change allows optimization of both cost and conductivity performance.
2Quantity of substance
If cheaper materials are used instead of gold, then cost is reduced, but electrical and thermal conductivity deteriorates
Solution Approach 1:
The patent uses composite materials to overcome the limitations of cheaper materials. By incorporating conductive fillers into the thermoplastic matrix, the bond wire achieves conductivity levels sufficient for electronic applications while using cost-effective base materials. The composite structure enables cheaper materials to meet performance requirements that would otherwise require expensive pure metals.
Solution Approach 2:
The patent applies local quality by concentrating conductive fillers in specific regions or at specific concentrations within the thermoplastic core, creating localized conductive pathways that provide the necessary electrical and thermal conductivity without requiring the entire bond wire to be made of expensive conductive material.
3Quantity of substance
If recycled materials are used for the core, then cost is reduced and sustainability is improved, but mechanical strength may deteriorate
Solution Approach 1:
The patent uses composite materials to reinforce recycled thermoplastic materials. The conductive fillers not only provide electrical and thermal conductivity but also act as reinforcement agents that enhance the mechanical strength of the recycled polymer matrix, allowing cost-effective recycled materials to meet mechanical performance requirements.
Solution Approach 2:
The patent changes the mechanical parameters of recycled materials by adjusting the composition, concentration, and morphology of conductive fillers. This parameter optimization allows recycled materials to achieve the necessary mechanical strength for bond wire applications while maintaining cost advantages and sustainability benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the cost of bond wires without sacrificing their quality, offering improved mechanical strength and tailored properties for specific applications by varying the proportion and type of thermoplastic core and conductive fillers.
Implementation Method 1
In order to increase the overall electrical and/or thermal conductivity characteristics of the bond wire, conductive fillers are blended with the thermoplastic material that comprises the core
Implementation Method 2
In order to increase the overall electrical and/or thermal conductivity characteristics of the bond wire, conductive fillers are blended with the thermoplastic material that comprises the core
Implementation Method 3
The method also includes providing a conductive material to the co-extrusion die of the extruder. When the core material and the non-conductive material have been provided to the co-extrusion die of the extruder, the core material forms a core as the core material passes through the co-extrusion die during a co-extrusion process
Data Source
AI summary
A bond wire has an outer layer formed of a conductive material and a core formed of a non-conductive material. The non-conductive material is blended with conductive fillers to enhance electrical and/or thermal conductivity characteristics of the bond wire.