Composite Bonding via Semi-Cured Electromagnetic Heating
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Solution Overview
Problem
The existing methods for bonding composite materials, such as those used in aircraft and marine vessels, face challenges in maintaining consistent bonding strength and efficiency due to poor semi-cured part formation and the complexity of preparation steps like lamination, debulking, and bagging, which increase production time and cost.
Innovation Solution
A method involving specific heating and electromagnetic field applications to control the curing state of composite materials, allowing regions to be bonded in a semi-cured state without the need for extensive preparation steps, using electromagnetic wave shields and metal nanocoils to separate heating regions and maintain precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If semi-cured parts are formed on split bodies for bonding, then bonding strength can be maintained, but the formation process becomes complex and quality control becomes difficult
Solution Approach 1:
The patent divides the composite material into a first body and a second body, each with designated bonding surfaces. The first body is divided into a first bonding surface and a first non-bonding surface, while the second body is divided into a second bonding surface and a second non-bonding surface. This segmentation allows independent control of bonding regions versus non-bonding regions, simplifying the overall process while maintaining bonding strength.
Solution Approach 2:
The patent applies different treatments to different regions of the composite materials. The bonding surfaces are kept in a semi-cured state to enable bonding, while the non-bonding surfaces are fully cured. This local differentiation is achieved through selective heating using electromagnetic wave shields and metal nanocoils, allowing precise control of curing state in specific regions without affecting the entire material.
2Strength
If thermosetting resin is arranged on outer surfaces for bonding, then bonding can be achieved, but the process becomes inefficient and cannot form complex shapes
Solution Approach 1:
The patent performs preliminary action by preparing the bonding surfaces in a semi-cured state before the actual bonding operation. The first and second bonding surfaces are maintained in a semi-cured state through selective heating, enabling them to bond efficiently when brought into contact. This eliminates the need for separate resin arrangement steps and allows direct bonding of the prepared surfaces.
Solution Approach 2:
The patent replaces the traditional mechanical system of arranging and heating thermosetting resin with an electromagnetic field-based system. Electromagnetic wave shields and metal nanocoils are used to selectively heat and maintain the bonding surfaces in a semi-cured state, eliminating the need for manual resin application and complex heating arrangements, thereby improving efficiency.
3Reliability
If multiple preparation steps (lamination, debulking, bagging) are performed, then composite materials can be produced, but production time increases significantly
Solution Approach 1:
The patent extracts and eliminates the unnecessary preparation steps (lamination, debulking, bagging) from the production process. By using pre-formed composite materials with designated bonding surfaces that are directly prepared in a semi-cured state, the patent removes the time-consuming intermediate steps while maintaining material quality through controlled semi-curing of bonding surfaces.
Solution Approach 2:
The patent changes the curing state parameter of the bonding surfaces to semi-cured, which enables direct bonding without requiring the full cycle of lamination, debulking, and bagging. This parameter change allows the bonding surfaces to be prepared and bonded in a single optimized process, significantly reducing production time while maintaining reliability.
4Reliability
If autoclave is used for producing composite materials, then materials can be assembled, but the process requires many preparation steps and takes a long time
Solution Approach 1:
The patent replaces the autoclave-based thermal processing system with an electromagnetic field-based system. Electromagnetic wave shields and metal nanocoils are used to selectively heat and semi-cure bonding surfaces, eliminating the need for autoclave processing and associated preparation steps. This substitution maintains assembly quality while dramatically improving assembly efficiency and reducing production time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient bonding of composite materials with consistent strength, reducing production time and costs by eliminating the need for complex preparation steps and ensuring quality control through chemical bonding.
Implementation Method 1
a first bonding region of the first composite material to be bonded to the second composite material is prepared to be maintained in a softened state; a first curing step performed after the first curing preparation step, wherein a first non-bonding region, which is a region other than the first bonding region, is placed in the cured state by heating
Implementation Method 2
a first bonding region of the first composite material to be bonded to the second composite material... a contact pressure step, wherein the first bonding region, having assumed the semi-cured state in the first semi-curing step, is pressed in contact with a second bonding region of the second composite material... a heat-bonding step, wherein the first and second bonding regions, having been brought into contact and pressed in the contact pressure step, are placed in the cured state by heating
Data Source
Figure 1~2
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AI summary
Provided is a method for bonding composite materials together in which bonding regions are suitably put into a semi-cured state and the composite materials are efficiently bonded together while the quality of the bonding strength of the composite materials is suitably maintained. The method for bonding a first composite material and a second composite material together includes the following respective steps. In step S12, a first bonding region of the first composite material is prepared to be maintained in a softened state. In step S14, a first non-bonding region of the first composite material is heated to be put into a cured state. In step S16, the first bonding region is put into a heatable state. In step S18, the first bonding region is heated to be put into a semi-cured state. In step S32, the first bonding region having been put into the semi-cured state is pressed in contact with a second bonding region of the second composite material that becomes a softened state or a semi-cured state. In step S34, the first bonding region and the second bonding region having been brought into contact with each other and pressed in the contacting and pressing step are heated to be put into a cured state.