Composite Carrier Warpage Management via CTE Mismatch
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Solution Overview
Problem
Current semiconductor processes face challenges with warpage management due to mismatched Coefficient of Thermal Expansion (CTE) between traditional temporary carriers and build-up layers, leading to distortion and contamination issues, and existing solutions are complex and costly.
Innovation Solution
A temporary composite carrier with a sandwich structure comprising a top substrate with a lower CTE and a bottom substrate with a higher CTE, along with an adhesive layer, is used to minimize stress and warpage by offsetting thermal expansion mismatch, and is designed to adhere debris, preventing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a traditional temporary carrier is used, then the structure is simple and cost-effective, but warpage and distortion occur due to CTE mismatch between the carrier and build-up layer
Solution Approach 1:
The patent applies composite materials by creating a temporary carrier with a multi-layer structure consisting of a first substrate, a second substrate, and an adhesive layer bonding them together. The first substrate has a first CTE and the second substrate has a second CTE that is different from the first CTE. This composite structure allows the carrier to compensate for thermal expansion mismatches with the build-up layer, reducing warpage and distortion while maintaining structural simplicity and cost-effectiveness.
2Manufacturing precision
If a vacuum system with evacuation device and jig is used to manage warpage, then the build-up layer remains flat, but the system becomes expensive and complicated with large space occupation
Solution Approach 1:
The patent applies self-service by designing a temporary carrier that automatically manages its own warpage through the inherent CTE mismatch between the first and second substrates. The multi-layer composite structure passively compensates for thermal expansion differences during heating and cooling cycles without requiring external vacuum systems, evacuation devices, or additional jigs. This self-compensating mechanism eliminates complex equipment while maintaining build-up layer flatness.
3Productivity
If the build-up layer is detached from the traditional carrier after processing, then the product can proceed to further processes, but the build-up layer becomes distorted causing registration problems
Solution Approach 1:
The patent applies composite materials by using a multi-layer temporary carrier with substrates of different CTE values that maintains build-up layer flatness throughout the processing sequence. When the build-up layer is detached from this composite carrier after processing, it remains undistorted because the carrier's layered structure compensated for thermal expansion mismatches during heating and cooling. This enables continuous processing while maintaining registration accuracy for subsequent steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite carrier effectively reduces warpage and distortion of build-up layers, maintaining chamber cleanliness and compatibility with existing semiconductor equipment, offering a simpler and cost-effective solution for warpage management.
Implementation Method 1
an adhesive layer configured in between the top substrate and a bottom substrate for combining the substrates tight together
Implementation Method 2
One of the embodiments discloses that the top substrate has a lower CTE and the bottom substrate has a higher CTE
Data Source
AI summary
A composite carrier is disclosed for warpage management as a temporary carrier in semiconductor process. Warpage is reduced for a product, semi-product, or build-up layer processed on the temporary composite carrier which is peeled off the temporary carrier in a later step. The composite carrier comprises a top substrate and a bottom substrate, an adhesive layer is configured in between the top substrate and a bottom substrate. One of the embodiments discloses the top substrate of the composite carrier having a lower CTE and the bottom substrate of the composite carrier having a higher CTE.