Composite Carrier Laser De-Bonding Without Package Damage

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Solution Overview

Problem

Existing methods for de-bonding carriers from integrated circuit packages, such as chemical mechanical polish and etching, are inefficient and costly, and there is a need for a more effective and cost-effective method to separate permanently bonded carriers without damaging the underlying components.

Innovation Solution

A composite carrier structure is used, comprising a transparent base carrier and an absorption layer that absorbs laser energy, allowing for laser ablation to separate the carrier from the package components, with optional reflection and pad layers to enhance energy absorption and reflection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If chemical mechanical polish or etching processes are used to de-bond carriers, then the carrier can be separated from package components, but the process is inefficient, costly, and may damage underlying components

Engineering Contradiction:

Improvedamage to underlying componentsVSAvoidde-bonding efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent replaces mechanical de-bonding processes (chemical mechanical polishing, grinding, etching) with a laser-based method. The laser beam selectively ablates the LTHC coating through optical energy conversion to heat, enabling non-contact, precise de-bonding that avoids mechanical damage to underlying components while maintaining high efficiency

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes the Light-To-Heat-Conversion (LTHC) coating's property of converting laser light to heat. By controlling laser parameters (wavelength, power, pulse duration) to match the LTHC absorption characteristics, the process achieves selective heating and ablation of the bonding layer without affecting adjacent materials, resolving the contradiction between efficiency and component safety

Inventive Principle:

Principle #35Parameter changes

2Strength

If permanent bonding through fusion bonding is used, then strong bonding is achieved, but de-bonding requires destructive processes

Engineering Contradiction:

Improvebonding strengthVSAvoidde-bonding process complexity

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent segments the carrier structure into distinct functional layers: a base carrier and an LTHC coating layer. This segmentation allows the LTHC layer to serve as a dedicated de-bonding interface that can be selectively removed by laser ablation, enabling easy separation of permanently bonded components without destroying the base carrier or underlying package components

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The LTHC coating acts as an intermediary layer between the base carrier and package components. This intermediate layer provides strong bonding during assembly while enabling controlled de-bonding through laser-induced ablation, thus facilitating both strong permanent bonding and easy subsequent separation

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The laser de-bonding process efficiently separates the carrier without damaging the underlying components, enabling reuse of the carrier, reducing costs, and improving throughput and uniformity by limiting the de-bonding interface to the absorption layer.

Implementation Method 1

A laser ablation process is performed using a laser beam that is configured to penetrate and not absorbed by the base carrier, and is absorbed by the absorption layer. Accordingly, the absorption layer is ablated

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

an absorption layer over the base carrier... A laser ablation process is performed using a laser beam that is configured to penetrate and not absorbed by the base carrier, and is absorbed by the absorption layer

Methodology Applied

Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Data Source

PatentUS20250293052A1Laser de-bonding carriers and composite carriers thereof

Publication Date: 2025.09.18 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes bonding a package component to a composite carrier. The composite carrier includes a base carrier and an absorption layer, and the absorption layer is between the base carrier and the package component. A laser beam is projected onto the composite carrier. The laser beam penetrates through the base carrier to ablate the absorption layer. The base carrier may then be separated from the package component.