Composite Ceramic Chip Blocks Piezoelectric Vibration
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Solution Overview
Problem
Multilayer ceramic capacitors in electronic devices generate acoustic noise due to piezoelectric vibrations, which are transferred to printed circuit boards, causing user discomfort, especially in slim and miniaturized devices where traditional noise reduction methods like increasing board thickness can compromise electrical properties.
Innovation Solution
A composite electronic component is created by coupling a multilayer ceramic capacitor with a ceramic chip, where the ceramic chip is disposed below the capacitor and has a cut portion to form a solder pocket, using a hard ceramic material to block vibrations and improve adhesive force with external electrodes, thereby reducing the transfer of vibrations to the printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the thickness of the printed circuit board is increased to reduce acoustic noise, then acoustic noise is decreased, but the electrical properties of the board deteriorate
Solution Approach 1:
A ceramic chip is introduced as an intermediary component between the multilayer ceramic capacitor and the printed circuit board. This ceramic chip has a cut portion that forms a solder pocket, creating an intermediate structure that blocks the transmission path of vibrations while maintaining proper electrical connections through the external electrodes and terminal electrodes.
Solution Approach 2:
The vibration blocking function is segmented from the printed circuit board itself and transferred to a separate ceramic chip component. This allows the board to maintain its original thin profile and electrical properties while the ceramic chip independently performs the vibration blocking function.
2Object-affected harmful factors
If the thickness of the printed circuit board is increased to reduce acoustic noise, then acoustic noise is decreased, but the device size increases
Solution Approach 1:
The vibration blocking function is segmented from the printed circuit board itself and transferred to a separate ceramic chip component. This allows the board to maintain its original thin profile and electrical properties while the ceramic chip independently performs the vibration blocking function.
Solution Approach 2:
The ceramic chip is made of hard ceramic material that provides vibration blocking properties. This composite structure combines the ceramic material's rigidity with the flexible circuit board design, achieving noise reduction without increasing overall device size.
3Object-affected harmful factors
If a ceramic chip with cut portion is introduced to block vibrations, then acoustic noise is reduced, but device complexity increases
Solution Approach 1:
The ceramic chip combines multiple functions in a single component: it provides mechanical support, blocks vibration transmission through its hard ceramic material, and creates the solder pocket structure for electrical connections. This merging reduces the need for separate components and simplifies the overall assembly process.
Solution Approach 2:
The ceramic chip serves multiple purposes simultaneously: it acts as a vibration barrier, provides structural support, enables proper soldering through the cut portion, and maintains electrical connectivity. This multi-functionality reduces the number of separate components needed and simplifies the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly decreases acoustic noise while maintaining the thickness of the printed circuit board, as the ceramic chip's hard material and cut portion effectively block vibrations and reduce solder-induced noise transfer, outperforming traditional methods.
Implementation Method 1
using a hard ceramic material to block vibrations and improve adhesive force with external electrodes, thereby reducing the transfer of vibrations to the printed circuit board
Implementation Method 2
Since the dielectric layer as described above has piezoelectricity and electrostriction, when a direct current (DC) or alternating current (AC) voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may occur between the internal electrodes, causing vibrations
Data Source
AI summary
A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.