Composite Ceramic Chip Reduces Acoustic Noise in MLCCs

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Solution Overview

Problem

Multilayer ceramic capacitors generate acoustic noise due to vibrations, which is a concern in slim and miniaturized electronic devices, and existing research lacks detailed understanding of noise reduction based on capacitor size, mounting manner, ceramic chip size, and electrode size.

Innovation Solution

A composite electronic component is formed by coupling a multilayer ceramic capacitor with a ceramic chip, where the ceramic chip is disposed below the capacitor, and specific ratios of their lengths and terminal electrode lengths are controlled to reduce acoustic noise, with the ceramic chip being made of hard alumina to block vibration transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a multilayer ceramic capacitor is used in slim and miniaturized electronic devices, then the device size is reduced and capacitance is improved, but acoustic noise increases due to vibrations

Engineering Contradiction:

Improvedevice sizeVSAvoidacoustic noise

Core Design Contradiction:

Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

A ceramic chip is introduced as an intermediary component between the multilayer ceramic capacitor and the printed circuit board. This ceramic chip acts as a mediator that blocks the transmission path of vibrations from the capacitor to the board, thereby reducing acoustic noise while allowing the capacitor to maintain its small size and high capacitance performance

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention utilizes the rigid properties of ceramic material to convert the harmful vibration transmission into a beneficial vibration-blocking function. The ceramic chip's stiffness and structural integrity transform it into an effective barrier against acoustic noise, turning a potentially problematic rigid material into a noise-reduction solution

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Object-generated harmful factors

If a ceramic chip is added below the multilayer ceramic capacitor to reduce acoustic noise, then acoustic noise is decreased, but device complexity increases

Engineering Contradiction:

Improveacoustic noiseVSAvoidcomponent structure

Core Design Contradiction:

Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The ceramic chip serves multiple functions simultaneously: it acts as a mechanical support structure for the capacitor, provides electrical isolation between components, and functions as a vibration-blocking element to reduce acoustic noise. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Object-generated harmful factors

If the ceramic chip size and electrode size are not optimized, then manufacturing is simpler, but acoustic noise reduction effectiveness is insufficient

Engineering Contradiction:

Improveacoustic noiseVSAvoidcomponent dimensions

Core Design Contradiction:

Object-generated harmful factorsVSManufacturing precision

Solution Approach 1:

The invention specifies optimized parameter ranges for the ceramic chip dimensions (length and width ratios relative to the capacitor) and electrode dimensions. By defining these specific parameter ranges, the patent achieves effective acoustic noise reduction while maintaining manufacturability within standard tolerances, balancing performance requirements with manufacturing capabilities

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The controlled ratios significantly decrease acoustic noise while maintaining adequate adhesion strength between the capacitor and chip, preventing excessive noise and ensuring sufficient bonding.

Implementation Method 1

the ceramic chip being made of hard alumina to block vibration transfer

Methodology Applied

Scientific EffectVibration blocking: Damping

Implementation Method 2

Since the dielectric layers have piezoelectric and electrostrictive characteristics, a piezoelectric phenomenon may occur between the internal electrodes when a direct current (DC) or alternating current (AC) voltage is applied to the multilayer ceramic capacitor, such that vibrations may be generated

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 3

Methodology Applied

Scientific EffectElectrostriction: Electrostriction

Data Source

PatentUS11043333B2Composite electronic component

Publication Date: 2021.06.22 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A composite electronic component includes: a composite body including a multilayer ceramic capacitor coupled to a ceramic chip, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween are stacked and first and second external electrodes disposed on opposite end portions of the first ceramic body in a length direction, respectively, and the ceramic chip including a second ceramic body including ceramic and first and second terminal electrodes, wherein a ratio of a length of the ceramic chip to a length of the multilayer ceramic capacitor is 0.7 to 1.0, and a ratio of a sum of a length of the first terminal electrode and a length of the second terminal electrode to the length of the ceramic chip is 0.3 to 0.6.