Composite Ceramic Component Vibration Damping

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Solution Overview

Problem

Multilayer ceramic capacitors in electronic devices generate acoustic noise due to piezoelectric vibrations, which becomes a concern in compact devices with frequent voltage changes, leading to user discomfort.

Innovation Solution

A composite electronic component is created by coupling a multilayer ceramic capacitor with a ceramic electronic component using a conductive or insulating adhesive, where the internal electrodes are perpendicular to the mounting surface, and the ceramic electronic component is made of paraelectric material or alumina, with a double-layer terminal electrode structure, to reduce vibration transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a multilayer ceramic capacitor is used in compact electronic devices with frequent voltage changes, then the capacitor provides necessary electrical function, but acoustic noise increases to audible levels

Engineering Contradiction:

Improveelectrical functionVSAvoidacoustic noise

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

A damping layer is introduced as an intermediary between the multilayer ceramic capacitor and the circuit board. This damping layer absorbs vibrations generated by the capacitor during voltage changes, preventing them from being transmitted to the circuit board and generating acoustic noise. The damping layer acts as a mediator that decouples the vibration source from the acoustic reflective surface.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs composite material structures, specifically combining the ceramic capacitor with a damping material layer. This composite structure allows the capacitor to maintain its electrical function while the damping layer material absorbs mechanical vibrations, thereby reducing acoustic noise emission from the circuit board assembly.

Inventive Principle:

Principle #40Composite materials

2Ease of operation

If the multilayer ceramic capacitor is mounted directly on the circuit board, then ease of mounting is improved, but vibration transfer to the board increases causing acoustic noise

Engineering Contradiction:

Improveease of mountingVSAvoidvibration transfer

Core Design Contradiction:

Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The damping layer serves as an intermediary mounting element between the capacitor and circuit board. It provides a mounting interface while simultaneously absorbing vibrations, thus maintaining ease of mounting through standard SMT processes while preventing vibration transfer to the board.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Power

If high voltage conditions are used in compact devices, then electrical performance is improved, but acoustic noise levels increase

Engineering Contradiction:

Improveelectrical performanceVSAvoidacoustic noise

Core Design Contradiction:

PowerVSObject-affected harmful factors

Solution Approach 1:

The damping layer converts the harmful vibration energy generated during high-voltage operation into beneficial thermal energy through internal friction and material damping. This transforms the mechanical stress and vibration that would otherwise cause acoustic noise into heat that is dissipated by the damping material.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly decreases acoustic noise by minimizing vibration transfer from the multilayer ceramic capacitor to the circuit board, preventing solder spread and reducing the risk of capacitor damage from mechanical stress.

Implementation Method 1

a ceramic electronic component coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic... significantly decreases acoustic noise by minimizing vibration transfer from the multilayer ceramic capacitor to the circuit board

Methodology Applied

Scientific EffectVibration absorption: Damping

Implementation Method 2

Since the dielectric layers have piezoelectric and electrostrictive properties, a piezoelectric phenomenon occurs between the internal electrodes when a direct current (DC) voltage or alternating current (AC) voltage is applied to the multilayer ceramic capacitor, and thus vibrations may be generated

Methodology Applied

Scientific EffectPiezoelectric phenomenon: Piezoelectric Effect

Data Source

PatentUS10229790B2Composite electronic component and board having the same

Publication Date: 2019.03.12 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic electronic component are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body comprising dielectric layers and internal electrodes, the internal electrodes having at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on first and second end portions of the first ceramic body. The ceramic electronic component includes a second ceramic body coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic; and first and second terminal electrodes disposed on first and second end portions of the second ceramic body and connected to the first and second external electrodes, and the multilayer ceramic capacitor and the ceramic electronic component have different lengths.