Composite Electrostatic Chuck Electrode for Thermal Shock Resistance
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Solution Overview
Problem
Conventional electrostatic chucks face issues with thermal shock resistance and durability due to high thermal expansion coefficients, leading to ceramic dielectric layer peeling or cracking, which shortens their service life and increases production costs in semiconductor manufacturing.
Innovation Solution
A method of manufacturing an electrostatic chuck using a heterogeneous composite material for the electrode layer, comprising aluminum or aluminum alloy powder and carbon-based nanomaterials, sintered through spark plasma sintering, with a dielectric layer formed via thermal spraying, to enhance heat dissipation, thermal shock resistance, and lightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional materials are used for the electrode layer, then the manufacturing process is simple, but the thermal shock resistance and durability are poor due to high thermal expansion coefficients causing ceramic dielectric layer peeling or cracking
Solution Approach 1:
The electrode layer is constructed as a composite material consisting of aluminum powder (5-20 wt%), carbon-based nanomaterials (0.1-5 wt%), and sintering aid powder (70-94.9 wt%). This composite structure combines the low thermal expansion coefficient of aluminum with the high thermal shock resistance of carbon-based nanomaterials, while the sintering aid enables proper sintering process. The synergistic effect of these components resolves the contradiction by achieving both improved thermal shock resistance and maintaining manufacturing feasibility.
Solution Approach 2:
The invention changes the material composition parameters of the electrode layer by introducing carbon-based nanomaterials in specific quantities (0.1-5 wt%) alongside aluminum powder and sintering aids. This parameter adjustment optimizes the thermal expansion coefficient and thermal shock resistance, allowing the electrode layer to withstand repeated heating and cooling cycles without causing ceramic dielectric layer failure, thus improving reliability while maintaining a manageable manufacturing process.
2Temperature
If aluminum or aluminum alloy is used for the electrode layer, then the heat dissipation property is improved, but the thermal shock resistance deteriorates due to high thermal expansion coefficient
Solution Approach 1:
The electrode layer combines aluminum powder (providing heat dissipation) with carbon-based nanomaterials (providing thermal shock resistance) and sintering aid powder. The aluminum component ensures efficient heat dissipation during semiconductor device operation, while the carbon-based nanomaterials compensate for the high thermal expansion coefficient of aluminum, enabling the composite to withstand thermal shock. This composite approach resolves the contradiction by achieving both heat dissipation and thermal shock resistance simultaneously.
3Productivity
If the electrostatic chuck is used in harsh environments with repeated heating and cooling, then the production efficiency is improved, but the durability decreases due to thermal shock causing ceramic dielectric layer failure
Solution Approach 1:
The invention modifies the electrode layer composition by incorporating carbon-based nanomaterials (0.1-5 wt%) and optimizing the aluminum powder content (5-20 wt%) alongside sintering aids. These parameter changes enable the electrode layer to maintain structural integrity under repeated thermal cycling conditions, preventing ceramic dielectric layer peeling or cracking. This allows the electrostatic chuck to operate reliably in harsh environments with repeated heating and cooling, maintaining both high production efficiency and durability.
4Reliability
If the carbon-based nanomaterial content is increased to improve thermal shock resistance, then the thermal shock resistance is improved, but the manufacturing cost increases
Solution Approach 1:
The invention optimizes the carbon-based nanomaterial content within a specific range (0.1-5 wt%) to achieve the desired thermal shock resistance while controlling material costs. Below 0.1 wt%, the thermal shock resistance improvement is insufficient; above 5 wt%, the cost increases significantly without proportional performance gains. This optimized parameter range provides the best balance between thermal shock resistance and manufacturing cost, allowing the electrode layer to withstand thermal shock while maintaining economic feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in an electrostatic chuck with improved durability and efficiency in harsh environments, reducing the need for frequent replacements and enhancing semiconductor production efficiency by maintaining high thermal conductivity and thermal shock resistance.
Implementation Method 1
preparing an electrode layer by sintering the composite powder through spark plasma sintering (SPS)
Implementation Method 2
the dielectric layer may be made of Al2O3, ZrO3, AlN, or Y2O3 and formed by thermal spraying
Data Source
AI summary
This application relates to a method of manufacturing an electrostatic chuck having good characteristics in heat dissipation, thermal shock resistance, and lightness. In one aspect, the method includes preparing a composite powder by ball-milling (i) aluminum or aluminum alloy powder and (ii) carbon-based nanomaterial powder. The method may also include preparing an electrode layer by sintering the composite powder through spark plasma sintering (SPS), and forming a dielectric layer on the electrode layer.