Composite Circuit Board for Thinner Image Capturing Assembly
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Solution Overview
Problem
Existing electronic devices face challenges in achieving a lightweight and thin design while incorporating multiple functions and improved performance, particularly in efficiently utilizing internal space for image capturing and audio components.
Innovation Solution
The use of a composite circuit board with a hard board part and flexible board parts that are directly connected, allowing the image capturing and audio components to be attached to non-parallel surfaces within the device's casing, enhancing space utilization and enabling thinner device profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are arranged on flat parallel surfaces, then manufacturing is simple, but space utilization is poor and device thickness increases
Solution Approach 1:
The patent transitions from arranging components on flat parallel surfaces (2D plane) to utilizing non-parallel surfaces including side walls and inner corners (3D space). The circuit board is configured to extend along non-parallel inner surfaces of the casing, enabling components to be placed in previously inaccessible angular spaces and thereby improving space utilization without complicating manufacturing.
2Adaptability or versatility
If multiple components are integrated to improve functionality, then device performance improves, but device complexity increases
Solution Approach 1:
The circuit board serves multiple functions simultaneously: it provides electrical connections for components, acts as a structural support element, and functions as a space-filling component that utilizes non-parallel spaces within the casing. By integrating these functions into a single element, the patent reduces overall device complexity while maintaining high functionality.
3Length of stationary object
If device thickness is reduced, then portability improves, but available internal space for components decreases
Solution Approach 1:
The patent nests components within the three-dimensional space formed by non-parallel surfaces, effectively utilizing angular spaces and internal corners that would otherwise be wasted. The circuit board is configured to extend along these non-parallel surfaces, nesting components efficiently within the available volume and enabling thinner device profiles without sacrificing component placement options.
Data Source
AI summary
An image capturing assembly including a composite circuit board, an image capturing component and a first audio component. The composite circuit board includes a hard board part and a first flexible board part that are directly connected to each other. The image capturing component is disposed on and electrically connected to the hard board part. The first audio component is disposed on and electrically connected to the first flexible board part.