Composite Clip Structure for Semiconductor Packages

Solution Overview

Problem

Conventional semiconductor packages using metal wires for signal exchange have low signal speed, degraded electrical properties, increased package size, and high manufacturing costs due to copper clips, which are heavy and costly.

Innovation Solution

A composite clip structure with a main metal layer of aluminum or aluminum alloy and a lower functional layer of copper or nickel, integrated to enable soldering and reduce weight and costs, facilitating electrical connections and heat dissipation in semiconductor packages.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If copper clips are used for electrical connection, then soldering performance is excellent, but manufacturing costs increase and weight increases

Engineering Contradiction:

Improvesoldering performanceVSAvoidmanufacturing costs

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies composite materials by creating a multi-layer clip structure where a copper layer (providing soldering performance) is combined with an aluminum layer (providing cost-effectiveness and weight reduction). This composite structure allows the clip to simultaneously achieve excellent soldering properties while reducing overall material costs and weight compared to pure copper clips.

Inventive Principle:

Principle #40Composite materials

2Reliability

If copper clips are used for electrical connection, then soldering performance is excellent, but weight increases

Engineering Contradiction:

Improvesoldering performanceVSAvoidclip weight

Core Design Contradiction:

ReliabilityVSWeight of moving object

Solution Approach 1:

The patent applies composite materials by creating a multi-layer clip structure where a copper layer (providing soldering performance) is combined with an aluminum layer (providing cost-effectiveness and weight reduction). This composite structure allows the clip to simultaneously achieve excellent soldering properties while reducing overall material costs and weight compared to pure copper clips.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If aluminum is used for clip material, then cost is reduced and weight is reduced, but soldering cannot be performed

Engineering Contradiction:

Improvemanufacturing costVSAvoidsoldering capability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent applies composite materials by creating a multi-layer clip structure where a copper layer (providing soldering performance) is combined with an aluminum layer (providing cost-effectiveness and weight reduction). This composite structure allows the clip to simultaneously achieve excellent soldering properties while reducing overall material costs and weight compared to pure copper clips.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies local quality by providing different material properties at different locations within the clip structure. The copper layer is positioned at the soldering interface to provide local soldering capability, while the aluminum layer forms the bulk of the clip structure to provide cost-effectiveness and weight reduction. This local differentiation of material properties allows the clip to satisfy multiple contradictory requirements.

Inventive Principle:

Principle #3Local quality

4Reliability

If metal wires are used for signal exchange, then electrical connection is established, but signal exchange speed is low and package size increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidsignal exchange speed

Core Design Contradiction:

ReliabilityVSSpeed

Solution Approach 1:

The patent replaces the conventional mechanical wire bonding system with a direct metal-to-metal clip contact system. This substitution eliminates the need for flexible metal wires and bonding processes, enabling direct electrical contact between chips through the clip structure, thereby significantly improving signal exchange speed and reducing package size.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composite clip structure reduces manufacturing costs and weight while enabling efficient soldering and improving electrical connections and heat dissipation in semiconductor packages, addressing the limitations of copper clips.

Implementation Method 1

a lower functional layer formed below the main metal layer and formed of a different type of metal from a metallic component of the main metal layer, wherein the lower functional layer is attached to the main metal layer to be integrated thereinto

Methodology Applied

Scientific EffectSoldering: Soldering

Data Source

PatentUS10896889B2Multilayer clip structure attached to a chip

Publication Date: 2021.01.19 JMJ KOREA CO LTD

AI summary

Disclosed is technology in that a clip structure formed of an inexpensive and light metallic material to easily performing soldering on a corresponding metal and to reduce costs of a semiconductor package and to reduce the weight of the semiconductor package. The composite clip structure bent at a predetermined angle and being in charge of electrical connection between components in a semiconductor package includes a main metal layer formed of a conductive material with a predetermined thickness, and a lower functional layer formed below the main metal layer and formed of a different type of metal from a metallic component of the main metal layer, wherein the lower functional layer is attached to the main metal layer to be integrated thereinto, and wherein the main metal layer is formed of a single metal containing a largest amount of aluminum (Al) or a metal mixture containing a largest amount of Al.