3D Printed Composite CMP Pad for Uniform Polishing
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Solution Overview
Problem
Traditional polishing pads used in chemical mechanical polishing (CMP) processes for semiconductor device fabrication suffer from non-uniform polishing results due to expensive and time-consuming manufacturing methods, leading to inconsistent material removal rates across substrate areas.
Innovation Solution
The development of composite polishing pads formed by depositing layers of different materials using 3D printing, where hard and elastic features are combined to create a unitary body with controlled mechanical properties, enabling improved polishing uniformity and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If polishing pads are manufactured by traditional molding, casting or sintering methods, then the manufacturing process is well-established, but the production is expensive and time-consuming, and polishing uniformity is poor
Solution Approach 1:
The patent applies parameter changes by transitioning from traditional molding/casting/sintering parameters to 3D printing parameters (layer thickness, deposition rate, material composition ratios). This enables precise control over pad structure and material distribution, achieving uniform polishing performance while reducing manufacturing time and cost through digital fabrication processes
Solution Approach 2:
The patent utilizes composite materials by combining different polyurethane materials with varying hardness, elasticity, and wear resistance properties in a single pad structure. This allows different regions of the pad to perform different functions (e.g., harder regions for material removal, softer regions for planarization), thereby achieving uniform polishing across the substrate surface while maintaining efficient production through additive manufacturing
2Adaptability or versatility
If polishing pads are made by injection molding one at a time, then each pad can be customized, but the manufacturing process is expensive and time-consuming
Solution Approach 1:
The patent applies parameter changes by using 3D printing technology with variable material deposition parameters. Different regions of the pad can be printed with different materials, layer thicknesses, and densities according to specific application requirements. This digital fabrication approach enables mass customization without the high costs and slow speeds of traditional injection molding, as designs can be modified through software and produced rapidly layer-by-layer
Solution Approach 2:
The patent applies segmentation by dividing the polishing pad into multiple functional zones with different material properties. Each zone can be independently designed and deposited during the 3D printing process, allowing customization of specific regions for different polishing functions while maintaining overall pad integration. This segmented approach enables versatile pad designs to be produced efficiently through additive manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite polishing pads achieve enhanced polishing uniformity, extended pad life, and reduced manufacturing costs by tuning mechanical properties through the selection and arrangement of materials, resulting in improved polishing performance and increased durability.
Implementation Method 1
formed by depositing layers of different materials using 3D printing
Implementation Method 2
composite polishing pads formed by depositing layers of different materials where hard and elastic features are combined to create a unitary body with controlled mechanical properties
Data Source
AI summary
Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.